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pro vyhledávání: '"R. Tanikella"'
Akademický článek
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Publikováno v:
IEEE Transactions on Device and Materials Reliability. 7:11-18
Within the assembly world, problems related to package contamination, which stem from material sourcing and assembly process excursions, can impact product reliability. From the reliability perspective, it is essential to achieve integrity at all int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59b08a250191b415f1b9a066b505cb3d
https://doi.org/10.1109/tdmr.2007.900057
https://doi.org/10.1109/tdmr.2007.900057
Publikováno v:
EDOC
Platforms, frameworks, and other forms of software assets are proliferating in the industry for well-documented reasons. Architects may choose from a wide variety of implementation technologies to realize their envisioned software architecture. Each
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f76cf2b9a93d80ece132e0254ceb7258
https://doi.org/10.1109/edoc.2008.46
https://doi.org/10.1109/edoc.2008.46
Autor:
R. Tanikella, P. Pillan, Y. Le Floc'h, Stuart Goose, Patrice Menard, H. Mollenhauer, Georg Schneider
Publikováno v:
Mobile Data Management
Bluetooth is a relatively new wireless technology that holds much promise as an inexpensive, power conserving, pervasive global standard for short-range communication with support for voice, data, ad-hoc networking and LAN access. A scalable LAN acce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6a2de47ff9be7ca3f5bff79bc70c092
https://doi.org/10.1109/mdm.2002.994414
https://doi.org/10.1109/mdm.2002.994414
Autor:
R. Tanikella, Swapan K. Bhattacharya, Paul A. Kohl, D. Balaraman, P. Markondeya Raj, Rao Tummala
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
Integration of passive components like resistors, inductors and capacitors into the substrate offers a number of advantages including better electrical performance, miniaturization, reliability and reduced part counts. The integral capacitor requirem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e02e0f06174e90a96addb67d085c1c7e
https://doi.org/10.1109/eptc.2002.1185602
https://doi.org/10.1109/eptc.2002.1185602
Publikováno v:
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
A new thermal processing technique, known as variable frequency microwave (VFM) curing, can perform the same processing as traditional thermal curing in minutes without compromising the intrinsic material properties. To verify that VFM curing results
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9468342870672741b1541d66d2bb9e55
https://doi.org/10.1109/ectc.2002.1008212
https://doi.org/10.1109/ectc.2002.1008212
Publikováno v:
ICME
Although compact mobile devices are convenient and have many advantages, their small screens can present problems. A significant proportion of HTML documents are optimally designed to look best when rendered on high-resolution displays of desktop and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5c088fb465438b5aa79d4efd01cb6d0
https://doi.org/10.1109/icme.2003.1221359
https://doi.org/10.1109/icme.2003.1221359
Conference
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Autor:
P. Cen, K. W. Bryant, Michael B. Fallon, R. Tanikella, I. M. Subbiah, A. M. Cohen, V. J. Liaw
Publikováno v:
Journal of Clinical Oncology. 29:311-311
311 Background: Few effective treatments exist for unresectable hepatic malignant lesions. The objective of this study was to analyze the patient outcomes and toxicities of yttrium-90 (Y90) radioembolization in patients with unresectable primary and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4af2144d9453a55ed3cdfd8d01aea53
https://doi.org/10.1200/jco.2011.29.4_suppl.311
https://doi.org/10.1200/jco.2011.29.4_suppl.311
Akademický článek
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