Zobrazeno 1 - 10
of 45
pro vyhledávání: '"R. Schöngrundner"'
Autor:
R. Schöngrundner, Bernhard Mayr, René Josef Prieler, Hannes Gerhardter, Jürgen Klarner, Christoph Hochenauer, Martin Landfahrer
Publikováno v:
Applied Thermal Engineering. 123:290-300
In this work the heating of mother tubes in a walking beam type reheating furnace has been investigated. The tubes are heated prior to further processing into seamless tubes in a downstream stretch reducing mill. In contrast to previous works, the he
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::495addf5f131ea523c964ad884ddb259
https://doi.org/10.1016/j.applthermaleng.2017.05.093
https://doi.org/10.1016/j.applthermaleng.2017.05.093
Publikováno v:
Powder Diffraction. 31:267-273
The deflection (curvature) of embedded single-crystal silicon chips was investigated by rocking curve X-ray diffraction techniques at two significant manufacturing stages in the process chain of printed circuit boards with embedded components. An ove
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8018225a38daf0437fab959d2e67c345
https://doi.org/10.1017/s0885715616000488
https://doi.org/10.1017/s0885715616000488
Autor:
Hans-Peter Gänser, R. Treml, R. Schöngrundner, Roland Brunner, O. Kolednik, Darjan Kozic, Daniel Kiener
Publikováno v:
Extreme Mechanics Letters. 8:235-244
Recently, the miniaturization of devices in the field of microelectronics has become more and more important. This also implies an increased complexity of the devices, where multilayer thin film systems play a major role. The use of various material
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d75ba2f55261ae2efd5e182726496b46
https://doi.org/10.1016/j.eml.2016.01.004
https://doi.org/10.1016/j.eml.2016.01.004
Publikováno v:
Microelectronics Reliability. 55:2382-2390
Modern printed circuit boards (PCB) are high performance products consisting of metal and dielectric materials in a multi-layered structure. Due to this build-up different failures, such as cracking or delamination, may occur during manufacturing and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c5ee7f1692b995dc83ea8cf0ccabbab
https://doi.org/10.1016/j.microrel.2015.06.055
https://doi.org/10.1016/j.microrel.2015.06.055
Autor:
Mike Morianz, T. Krivec, Martin Pletz, Paul Angerer, Thomas Antretter, M. Brizoux, Katerina Macurova, Raul Bermejo, A. Lecavelier, R. Schöngrundner
Publikováno v:
Materials Today: Proceedings. 2:4196-4205
Thermally induced stresses created during package manufacturing and their roles in mechanical failure are important issues for the microelectronic industry. In the present paper, a numerical analysis of the die embedding process into a printed circui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c2102f5fe44641029ef4ac74531ab05
https://doi.org/10.1016/j.matpr.2015.09.003
https://doi.org/10.1016/j.matpr.2015.09.003
Autor:
Thomas Antretter, Werner Ecker, R. Treml, R. Schöngrundner, Roland Brunner, Darjan Kozic, Daniel Kiener
Publikováno v:
Thin Solid Films. 564:321-330
Residual stresses and their distribution within individual layers are a general concern in thin film technology. Here we use a recently developed ion beam layer removal method to determine the stress profile in a thin film system. The system consists
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f1ec8544fb97e34c3d32da39ea2fd5b4
Publikováno v:
International Journal of Fracture. 187:77-107
It is well known that the application of the conventional $$J$$ -integral is connected with severe restrictions when it is applied for elastic–plastic materials. The first restriction is that the $$J$$ -integral can be used only, if the conditions
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b52b7619e1bdfebdf82932b79b071da
https://doi.org/10.1007/s10704-013-9920-6
https://doi.org/10.1007/s10704-013-9920-6
Autor:
Hans-Peter Gänser, R. Treml, Daniel Kiener, Roland Brunner, Darjan Kozic, Thomas Antretter, R. Schöngrundner, Verena Maier-Kiener
Publikováno v:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Nanoscale, multi-material thin film structures are commonly used in the design of microelectronic devices. Composites like these have the advantage of occupying a small volume in a specific device which makes a realization of 3D integrated circuits e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b4854771d93557cd80fd0f3d71e2cbc
https://doi.org/10.1109/eurosime.2016.7463352
https://doi.org/10.1109/eurosime.2016.7463352
Publikováno v:
International Journal of Fracture. 174:61-74
Configurational forces invariably appear at the external boundaries of cracked bodies (including the crack faces), but it is unclear whether they influence crack growth. Also, it is unclear how such boundary configurational forces are related to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7335e9ec2b719045f4217517f3e8955
https://doi.org/10.1007/s10704-011-9672-0
https://doi.org/10.1007/s10704-011-9672-0
Publikováno v:
Key Engineering Materials. :297-300
This paper deals with the determination of the crack driving force in elastic-plastic materials and its correlation with the J-Integral approach. In a real elastic-plastic material, the conventional J-integral cannot describe the crack driving force.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4450d56aa98405d65ee6046c16d87bae
https://doi.org/10.4028/www.scientific.net/kem.417-418.297
https://doi.org/10.4028/www.scientific.net/kem.417-418.297