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pro vyhledávání: '"R. Rico Hellín"'
A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200 °C
Publikováno v:
Microsystem Technologies. 13:1451-1456
This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 °C based on nickel plating and photoresist sacrificial layers. The advantages of thin film caps
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::907373b51de47ee2b6b969f30a5dcabc
https://doi.org/10.1007/s00542-006-0351-4
https://doi.org/10.1007/s00542-006-0351-4
