Zobrazeno 1 - 10
of 7 777
pro vyhledávání: '"R. P. H. Chang"'
Publikováno v:
Journal of Applied Physics; 2014, Vol. 115 Issue 3, p1-9, 9p, 1 Chart, 7 Graphs
Autor:
Tiwari, Jitendra N.1 (AUTHOR) jnt_tiw123@yahoo.co.in, Kumar, Krishan2 (AUTHOR), Safarkhani, Moein3,4 (AUTHOR), Umer, Muhammad5 (AUTHOR), Vilian, A. T. Ezhil1 (AUTHOR), Beloqui, Ana2,6 (AUTHOR), Bhaskaran, Gokul3 (AUTHOR), Huh, Yun Suk3 (AUTHOR) yunsuk.huh@inha.ac.kr, Han, Young‐Kyu1 (AUTHOR) ykenergy@dongguk.edu
Publikováno v:
Advanced Science. 9/4/2024, Vol. 11 Issue 33, p1-65. 65p.
Autor:
Meise, Ansgar1 (AUTHOR), Heggen, Marc1 (AUTHOR) m.heggen@fz-juelich.de, Dunin‐Borkowski, Rafal E.1 (AUTHOR), Armbrüster, Marc2 (AUTHOR)
Publikováno v:
Small Science. Aug2024, Vol. 4 Issue 8, p1-10. 10p.
Autor:
Javed, Adnan1, Nasir, Muhammad Farooq1 farooq.nasir@riphah.edu.pk, Qasim, Irfan2, Alanazi, ousef Mohammed3, Khan, Muhammad Tahir4
Publikováno v:
International Journal of Electrochemical Science. Aug2024, Vol. 19 Issue 8, p1-12. 12p.
Publikováno v:
Handbook of Science and Technology Convergence ISBN: 9783319040332
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab87c7b9687ef7afcbd1867ff3cc3a4c
https://doi.org/10.1007/978-3-319-04033-2_72-1
https://doi.org/10.1007/978-3-319-04033-2_72-1
Publikováno v:
Handbook of Science and Technology Convergence ISBN: 9783319040332
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30008209e51d7d031b4ecb971b41e130
https://doi.org/10.1007/978-3-319-04033-2_55-1
https://doi.org/10.1007/978-3-319-04033-2_55-1
Autor:
An M; Center for Advanced Analytical Science, School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong, 510006, China.; Department of Materials Science and Engineering, Southern University of Science and Technology (SUSTech), Shenzhen, Guangdong, 518055, China.; Strait Institute of Flexible Electronics (SIFE, Future Technologies), Fujian Key Laboratory of Flexible Electronics, Fujian Normal University, Fuzhou, Fujian, 350117, China., Liu Q; Center for Advanced Analytical Science, School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong, 510006, China., Jeong SY; Department of Chemistry, Korea University, Seoul, 136-713, South Korea., Liu B; Department of Materials Science and Engineering, Southern University of Science and Technology (SUSTech), Shenzhen, Guangdong, 518055, China., Huang E; Department of Materials Science and Engineering, Southern University of Science and Technology (SUSTech), Shenzhen, Guangdong, 518055, China., Liang Q; Center for Advanced Analytical Science, School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong, 510006, China., Li H; Center for Advanced Analytical Science, School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong, 510006, China., Zhang G; College of New Materials and New Energies, Shenzhen Technology University, Shenzhen, Guangdong, 518118, China., Woo HY; Department of Chemistry, Korea University, Seoul, 136-713, South Korea., Niu L; Center for Advanced Analytical Science, School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong, 510006, China., Guo X; Department of Materials Science and Engineering, Southern University of Science and Technology (SUSTech), Shenzhen, Guangdong, 518055, China., Sun H; Center for Advanced Analytical Science, School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong, 510006, China.; Department of Materials Science and Engineering, Southern University of Science and Technology (SUSTech), Shenzhen, Guangdong, 518055, China.; State Key Laboratory of Polymer Physics and Chemistry, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun, 130022, China.; School of Chemistry and Chemical Engineering, Gannan Normal University, 341000, Ganzhou, China.
Publikováno v:
Angewandte Chemie (International ed. in English) [Angew Chem Int Ed Engl] 2024 Oct 15, pp. e202410498. Date of Electronic Publication: 2024 Oct 15.
Publikováno v:
Applied Physics Letters. 82:1452-1454
A layered device including a substrate; an adhering layer thereon. An electrical conducting layer such as copper is deposited on the adhering layer and then a barrier layer of an amorphous oxide of TiAl followed by a high dielectric layer are deposit
Autor:
Wang, Guang1 (AUTHOR), Fan, Hongzhao1 (AUTHOR), Chen, Zhongwei2 (AUTHOR), Gao, Yufei3 (AUTHOR), Wang, Zuankai4 (AUTHOR), Li, Zhigang1 (AUTHOR), Lu, Haipeng2 (AUTHOR) haipenglu@ust.hk, Zhou, Yanguang1 (AUTHOR) maeygzhou@ust.hk
Publikováno v:
Advanced Science. 7/3/2024, Vol. 11 Issue 25, p1-9. 9p.