Zobrazeno 1 - 10
of 82
pro vyhledávání: '"R. Metasch"'
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::321b054154724b3625bd73c6357b614c
https://doi.org/10.1109/eurosime54907.2022.9758860
https://doi.org/10.1109/eurosime54907.2022.9758860
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93ca097d6dc34fdec61d097970e5b07e
https://doi.org/10.1109/eurosime54907.2022.9758911
https://doi.org/10.1109/eurosime54907.2022.9758911
Autor:
Stefan Weihe, Ulrich Becker, Mike Roellig, Marta Kuczynska, R. Metasch, Natalja Schafet, A. Kabakchiev
Publikováno v:
Microelectronics Reliability. 91:67-85
In the past, a large number of material models for Sn-based solder alloys have been proposed, which are usually calibrated based on the material testing under isothermal conditions. However, their ability to map the lifetime differences depending on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3530f8d77dae2646f2eee125ccbabaf
https://doi.org/10.1016/j.microrel.2018.06.007
https://doi.org/10.1016/j.microrel.2018.06.007
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper presents a numerical comparison of stress-strain conditions in solder joints by the application of a unified primary-secondary creep model and state of the art stationary creep model approach. Both extracted material models are fitted on t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b6981f3b378b79f06d93d5d4c208872
https://doi.org/10.1109/eurosime48426.2020.9152683
https://doi.org/10.1109/eurosime48426.2020.9152683
Publikováno v:
Microelectronics Reliability. 87:125-132
In this work we introduce an experimental setup for experiments on combined thermal and vibration loadings applied to surface mount technology electronic systems. The setup provides well-defined load conditions and the ability of in-situ load measure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0188ccb059be287a0ab07c1e08de9379
https://doi.org/10.1016/j.microrel.2018.06.003
https://doi.org/10.1016/j.microrel.2018.06.003
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
This paper presents a comparison of three different material models, which are currently used to describe creep behaviour of solder alloys in thermo-mechanical use cases. The first model is the commonly utilized Garofalo approach. This approach is ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e35888929434dce323eadcf7de4aed5c
https://doi.org/10.23919/empc44848.2019.8951810
https://doi.org/10.23919/empc44848.2019.8951810
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper presents a methodology to investigate and correlate the influence of porosity of silver sintered interconnects, e.g. used in power electronics, with their thermo-mechanical deformation behaviour. The proposed methodology includes the devel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7c14f39cc05db2c3e698e3cf7bcad3e
https://doi.org/10.1109/eurosime.2019.8724573
https://doi.org/10.1109/eurosime.2019.8724573
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
The development team has set itself the task of creating a new type of testing system for faster and more cost-effective reliability and service life evaluation. This system additionally measure in-situ the mechanical deformation and shear forces in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::988f50f58c43a14608be9cdff9a7cc9b
https://doi.org/10.1109/eptc.2018.8654375
https://doi.org/10.1109/eptc.2018.8654375
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
The authors have realized a measurement approach for the determination of thermal-mechanical characteristics of real silver-sinter joints under shear load conditions. The paper present the developed and optimized measurement setup and the manufacturi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7e6b824268bca86058723b8b1d160d8
https://doi.org/10.1109/estc.2018.8546403
https://doi.org/10.1109/estc.2018.8546403
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
The usage of virtual evaluation tools based on the finite-element-method (FEM) is already widespread in the area of electronics. At the assembly level the geometries and material compositions of these models is oftentimes very complex. Here substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ea7e9a00730409257a390959e673e82
https://doi.org/10.1109/estc.2018.8546495
https://doi.org/10.1109/estc.2018.8546495