Zobrazeno 1 - 10
of 93
pro vyhledávání: '"R. Markovich"'
Autor:
Zachary R. Markovich, Jessica H. Hartman, Ian T. Ryde, Kathleen A. Hershberger, Abigail S. Joyce, Patrick L. Ferguson, Joel N. Meyer
Publikováno v:
Current Research in Toxicology, Vol 3, Iss , Pp 100084- (2022)
Aims: Mitochondrial dysfunction is implicated in several diseases, including neurological disorders such as Parkinson’s disease. However, there is uncertainty about which of the many mechanisms by which mitochondrial function can be disrupted may l
Externí odkaz:
https://doaj.org/article/af65153e866440f4a28635d49c513a85
Publikováno v:
International Symposium on Microelectronics. 2012:000949-000954
Rigid-flex allows designers to replace multiple substrates interconnected with connectors, wires, and ribbon cables with a single package offering improved performance, reliability, and a potential cost-effective solution. However, processing and mat
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001527-001546
There is a strong desire to develop advanced electronic substrates that can meet the growing demand for miniaturization, high-speed performance, and flexibility for medical devices. To accomplish this, new packaging structures need to be able to inte
Publikováno v:
Circuit World. 37:38-45
PurposeThere has been increasing interest in the development of printable electronics to meet the growing demand for low‐cost, large‐area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic appl
Autor:
Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Rabindra N. Das, Francesco Marconi, Timothy Antesberger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001949-001976
Material formulation, structuring, and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabrication of
Autor:
Konstantinos I. Papathomas, Voya R. Markovich, John M. Lauffer, Mark D. Poliks, Rabindra N. Das
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002011-002050
Passives account for a very large part of today's electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, computers and several critical defense devices. This paper presents an entire process from de
Autor:
John M. Lauffer, Jianzhuang Huang, Rabindra N. Das, How T. Lin, Mark D. Poliks, Voya R. Markovich
Publikováno v:
International Symposium on Microelectronics. 2011:001012-001020
This paper examines the use of different materials in the area of printing technology. A variety of printable nanomaterials for electronic packaging have been developed. This includes nano capacitors and resistors as embedded passives, nano laser mat
Publikováno v:
International Symposium on Microelectronics. 2011:000469-000475
In this paper, the use of electrically conducting adhesives (ECA) to form z-axis interconnections for next generation packaging is discussed. In particular, current efforts related to Z-axis interconnections for device level fabrication, integration,
Autor:
R N Das, V R Markovich
Publikováno v:
IEEE Nanotechnology Magazine. 4:18-26
This article examines the use of nanomaterials in the area of electronic packaging. This includes capacitors and resistors as embedded passives, low-k materials, electrically conducting adhesives (ECAs) as interconnects, thermal interface materials (
Publikováno v:
Circuit World. 36:24-32
PurposeMaterial formulation, structuring and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabricati