Zobrazeno 1 - 10
of 510
pro vyhledávání: '"R. J. von Gutfeld"'
Autor:
Alan C. West, R. J. von Gutfeld
Publikováno v:
Journal of Applied Electrochemistry. 38:531-536
We have used an in situ technique that removes the oxide from the surface of the alloy titanium 6-2-4-2, followed by copper electroplating of the surface. The oxide removal is accomplished by means of a short voltage pulse from a discharging capacito
Autor:
C. C. Tsuei, James A. Misewich, Jonathan Z. Sun, W. M. Donath, Ayush Gupta, R. J. von Gutfeld, A. G. Schrott, Brent A. Scott, Dennis M. Newns, T. Doderer, B.M. Grossman, P.C. Pattnaik
Publikováno v:
Journal of Electroceramics. 4:339-344
A field effect transistor device (FET), consisting of a nonlinear Mott Insulator channel material, and a high dielectric-constant gate oxide, is explored as a nanoscale device. Experimental functionality of a large scale prototype (5 μm channel leng
Autor:
R. J. von Gutfeld, K. G. Sheppard
Publikováno v:
IBM Journal of Research and Development. 42:639-653
Laser-enhanced processes have found an increasingly important role as the interest in microfabrication continues to grow. An especially attractive feature of laser processing in liquids is the ability to obtain maskless patterning in the form of mate
Publikováno v:
Applied Physics Letters. 81:1913-1915
This letter evaluates the feasibility for implanting short segments of Barkhausen wires in treatment volumes of patients requiring radiation therapy. Such locating of deep-seated sites prior to each treatment is not done routinely or is usually achie
Publikováno v:
Applied Physics Letters. 64:3348-3350
Insulating thin‐film patterns have been deposited on a variety of metal surfaces using focused laser light incident on samples submerged in both electrolytic and electroless nickel solutions. Deposits occur only where the laser radiation is absorbe
Publikováno v:
Applied Physics Letters. 61:1066-1068
Experiments are described in which ∼0.2‐s‐wide argon laser pulses are incident on a 6‐μm‐thick n− Si epitaxial layer. Local melting and refreezing of both the layer and a small volume of the underlying p+ boron‐doped Si substrate occur
Publikováno v:
Applied Physics Letters. 59:3490-3492
We describe a series of experiments using local heating to deposit copper from solution onto a palladium pattern. We show that palladium, the more noble metal, does not dissolve during thermally induced exchange plating when sacrificial copper is app
Autor:
D. R. Vigliotti, R. J. von Gutfeld
Publikováno v:
Applied Physics Letters. 56:2584-2586
A two‐step method for the repair of circuit board defects consisting of complete opens is described. First, a small copper bridge is grown in unacidified copper sulfate solution by passing a few milliamperes of ac current at a frequency of 2–2000
Publikováno v:
Journal of The Electrochemical Society. 156:D564
Copper and nickel are electrodeposited onto aluminum by using a pulsed laser, which removes the native oxide in situ. The method is shown to work on aluminum simply immersed in a plating electrolyte, via exchange plating, or on aluminum with an impos