Zobrazeno 1 - 4
of 4
pro vyhledávání: '"R. J. Strittmatter"'
Autor:
Gary R. Buske, T. M. Stokich, H. C. Silvis, J. D. Perry, James P. Godschalx, Robert E. Hefner, John W. Lyons, K. B. Ouellette, Jerry L. Hahnfeld, Thomas H. Kalantar, Qing Shan J. Niu, R. J. Strittmatter, J. M. Dominowski, E. Mubarekyan
Publikováno v:
MRS Proceedings. 766
Porous SiLK resin is an ultra-low-k interlayer dielectric (ILD) material designed to meet the needs of the 65 nm technology node and beyond. In early 2002, the porous SiLK resin formulation was defined and scaled up, facilitating the tight monitoring
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::705cc18a153f3f80d744da44ef667123
https://doi.org/10.1557/proc-766-e7.5
https://doi.org/10.1557/proc-766-e7.5
Publikováno v:
ChemInform. 20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47500bf118106702345899cf68c77c4e
https://doi.org/10.1002/chin.198930058
https://doi.org/10.1002/chin.198930058
Publikováno v:
ChemInform. 20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::885ac1ffbcd9da875455798869befae2
https://doi.org/10.1002/chin.198930057
https://doi.org/10.1002/chin.198930057
Autor:
B. E. Bursten, R. J. Strittmatter
Publikováno v:
ChemInform. 19
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d8827ca3a5ee150b835ace74cde3237
https://doi.org/10.1002/chin.198807068
https://doi.org/10.1002/chin.198807068