Zobrazeno 1 - 10
of 43
pro vyhledávání: '"R. Hasumi"'
Publikováno v:
IEEE transactions on electromagnetic compatibility. 49(2):263-269
A simultaneous measurement method using a parallel modulated probe array is proposed to measure the electromagnetic field radiated by antennas at different locations simultaneously. Each modulated probe is excited by a local signal with different fre
Autor:
Hirofumi Yamashita, H. Ootani, R. Hasumi, K. Honda, Yoshiaki Toyoshima, K. Eda, A. Mochizuki, Tatsuya Ohguro, Yoshitaka Egawa, T. Asami, Hiroki Sasaki, Hisayo Momose, Y. Sugiura
Publikováno v:
SPIE Proceedings.
Back Side Illumination (BSI) CMOS image sensors with two-layer photo detectors (2LPDs) have been fabricated and evaluated. The test pixel array has green pixels (2.2um x 2.2um) and a magenta pixel (2.2um x 4.4um). The green pixel has a single-layer p
Autor:
R. Hasumi, James M. Williamson, Atsushi Nakajima, Koji Kaya, Terry A. Miller, Christopher C. Carter, H. Watanabe, M. Hirano
Publikováno v:
The Journal of Physical Chemistry A. 101:392-398
The geometric structures of 7-azaindole−water complexes, (7-AzI)-(H2O)n (n = 1−3), and 7-AzI dimer were investigated by laser-induced fluorescence (LIF) spectroscopy with high resolution (∼0.01 cm-1). For the 7-AzI−(H2O)n complexes (n = 1−3
Publikováno v:
2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).
3D TCAD analysis of blooming for 1.4 μm CMOS image sensor (CIS) with two-shared pixel structure has been performed. Its blooming behavior has been modeled and clear design guidelines for potential control inside CIS pixels have been obtained.
Autor:
J. Pape, Nam-Sung Kim, Martin Ostermayr, Deleep R. Nair, Melanie J. Sherony, Craig S. Lage, Jaeger Daniel, Franck Arnaud, Y. Gao, Deok-Hyung Lee, H.S. Yang, C. Schiller, X. Chen, S. Stiffler, An L. Steegen, Kenneth J. Stein, J. Sudijono, Christopher V. Baiocco, Haoren Zhuang, Robert C. Wong, Y. Takasu, Ho-Kyu Kang, Sayeed A. Badrudduza, J. Wallner, Laegu Kang, James Chingwei Li, Aaron Thean, Y.W. Teh, L. Zhuang, R. Hasumi, S. Samavedam, D.P. Sun, Mukesh Khare
Publikováno v:
2008 IEEE International Electron Devices Meeting.
This paper describes SRAM scaling for 32 nm low power bulk technology, enabled by high-K metal gate process, down to 0.149 mum2 and 0.124 mum2. SRAM access stability and write margin are significantly improved through a 50% Vt mismatch reduction, tha
Autor:
R. Hasumi, Mariko Takayanagi, K. Fogel, Haizhou Yin, M. Biscardi, Masafumi Hamaguchi, Henry K. Utomo, H. Kang, James Chingwei Li, Kazuya Ohuchi, Paul Ronsheim, Kazunari Ishimaru, R. Zhang, Z. Zhu, D.-G. Park, Anthony G. Domenicucci, Katherine L. Saenger, Chun-Yung Sung, Ghavam G. Shahidi, Ryosuke Iijima, D. K. Sadana, Y. Takasu, Nivo Rovedo, J. P. de Souza, John A. Ott
Publikováno v:
2008 Symposium on VLSI Technology.
Twisted direct silicon bonded (DSB) substrate demonstrates a higher hole mobility advantage over (110) bulk substrate for PFET. The mobility shows a (110) layer thickness dependence with the thinner DSB layer having a higher hole mobility. 25% on-cur
Autor:
Dae-Gyu Park, T.H. Ning, Kazuya Ohuchi, Haizhou Yin, Katherine L. Saenger, Richard L. Kleinhenz, Masafumi Hamaguchi, Devendra K. Sadana, Kazunari Ishimaru, Nivo Rovedo, J. Cai, K. Fogel, Chun-Yung Sung, Gerd Pfeiffer, X. Chen, R. Zhang, Z. Luo, Mariko Takayanagi, John A. Ott, R. Hasumi, Ghavam G. Shahidi
Publikováno v:
2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
End-of-range (EOR) defects generated during the crystal orientation conversion process in DSB technology can give rise to various types of junction leakage depending on their locations relative to device structures. A wide range of EOR defect depths
Autor:
K. Fogel, Haizhou Yin, X. Chen, R. Klemhenz, Z. Luo, James Chingwei Li, Mukesh Khare, K. Ohuchr, Kenneth J. Stein, Mariko Takayanagi, Thomas A. Wallner, R. Zhang, John A. Ott, R. Hasumi, Gerd Pfeiffer, Katherine L. Saenger, R. Bendernagel, S. Crowder, Ghavam G. Shahidi, M. Hamaguchr, Chun-Yung Sung, D. K. Sadana, Nivo Rovedo, H. Ng, Kazunari Ishimaru, D.-G. Park
Publikováno v:
2007 IEEE Symposium on VLSI Technology.
When DSB bonding interface falls into highly doped S/D direct silicon bonded (DSB) technology is shown to be scalable regions, there are concerns of high S/D leakage (due to the possible for 32 nm node and beyond for two integration schemes: solid ph
Autor:
Junji Koga, Yoshio Nishi, Takashi Kinoshita, A. Kinoshita, Ken Uchida, S. Toriyama, R. Hasumi
Publikováno v:
2006 International Electron Devices Meeting.
The carrier transport in dopant-segregated Schottky (DSS) and conventional MOSFETs was thoroughly investigated in terms of carrier injection velocity, vinj. It was found that vinj enhancement associated with the velocity overshoot enhances the curren
Autor:
Katsura Miyashita, Takashi Kinoshita, Yoshiaki Toyoshima, T. Komoda, A. Kinoshita, K. Adachi, R. Hasumi, Fumiyoshi Matsuoka, Junji Koga, S. Yamada, Masafumi Hamaguchi, T. Nakayama
Publikováno v:
2006 International Electron Devices Meeting.
Ultra low power circuit operation is demonstrated with dopant segregated Schottky (DSS) source/drain transistors for the first time. DSS greatly improves propagation delay in multiple fan-in NAND gates at constant standby current. The delay is enhanc