Back-side integration of Hybrid III–V on Silicon DBR lasers

Autor: Pierre Brianceau, Jacques-Alexandre Dallery, Christophe Jany, Sebastien Cremer, J. Durel, T. Card, Badhise Ben Bakir, Jean-Emmanuel Broquin, Frederic Boeuf, Loic Sanchez, Karim Hassan, R. Thibon, Bertrand Szelag, V. Larrey, T. Bria, R. Guiavarch

Publikováno v: 2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Apr 2017, Hsinchu, Taiwan. pp.1-2, ⟨10.1109/VLSI-TSA.2017.7942492⟩

International audience; In this paper we demonstrate the monolithic integration of a fully CMOS compatible hybrid DBR laser on the backside of a SOI wafer. This innovative approach allowed implementing CMOS compatible electric interconnects and optic

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4cec74ea38e6de6f8bf5be43d335cdf
https://hal.archives-ouvertes.fr/hal-02019688

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