Výsledky vyhledávání - "R. Buttiglione"

Packaged single pole double thru (SPDT) and true time delay lines (TTDL) based on RF MEMS switches

Autor: Benno Margesin, A. Maglione, Andrea Lucibello, Flavio Giacomozzi, Romolo Marcelli, M. Dispenza, G. De Angelis, Mirko Erspan, S. Catoni, C. Combi, A. Lanciano, R. Buttiglione

Publikováno v: International Semiconductor Conference, IEEE CAS 2008, pp. 227–230, Sinaia, Romania, October 13-15, 2008
info:cnr-pdr/source/autori:De Angelis G, Lucibello A, Marcelli R, Catoni S, Lanciano A, Buttiglione R, Dispenza M, Giacomozzi F, Margesin B, Maglione A, Erspan M, Combi C/congresso_nome:International Semiconductor Conference, IEEE CAS 2008/congresso_luogo:Sinaia, Romania/congresso_data:October 13-15, 2008/anno:2008/pagina_da:227/pagina_a:230/intervallo_pagine:227–230

Packaged MEMS devices for RF applications have been modelled, realized and tested. In particular, RF MEMS single ohmic series switches (SPST) have been obtained on silicon high resistivity substrates and they have been integrated in alumina packages

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bfd2b480b9b0128eaae904b8ce3d583d
http://www.cnr.it/prodotto/i/87052

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Alumina and LTCC technology for RF MEMS switches and true time delay lines

Autor: S. Catoni, Anna Maria Fiorello, M. Ladhes, Kari Kautio, Romolo Marcelli, R. Buttiglione, G. De Angelis, M. Dispenza, Kari Rönkä

Publikováno v: Buttiglione, R, Catoni, S, De Angelis, G, Dispenza, M, Fiorello, A, Kautio, K, Lahdes, M, Marcelli, R & Rönkä, K 2008, Alumina and LTCC technology for RF MEMS switches and true time delay lines . in Proceedings of the 3rd European Microwave Integrated Circuit Conference, EuMIC 2008 . IEEE Institute of Electrical and Electronic Engineers, Piscataway, NJ, USA, pp. 366-369, 3rd European Microwave Integrated Circuit Conference, EuMIC 2008, Amsterdam, Netherlands, 27/10/08 . https://doi.org/10.1109/EMICC.2008.4772305
3rd European Microwave Integrated Circuits Conference, EuMW 2008, pp. 366–369, Amsterdam, The Netherlands, 27-31 October 2008
info:cnr-pdr/source/autori:Buttiglione R, Catoni S, De Angelis G, Dispenza M, Fiorello A, Kautio K, Ladhes M, Marcelli R, Ronka K/congresso_nome:3rd European Microwave Integrated Circuits Conference, EuMW 2008/congresso_luogo:Amsterdam, The Netherlands/congresso_data:27-31 October 2008/anno:2008/pagina_da:366/pagina_a:369/intervallo_pagine:366–369

The technology for the realization of RF MEMS ohmic series switches on LTCC substrates has been set up for their implementation in true time delay line configurations. Alumina and LTCC structures for validating the technological process on the indivi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::799c4b691912d8c9b575a68945edc017
https://cris.vtt.fi/en/publications/7e831563-fef5-4ba4-95b0-ce9a13ae9640

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Preparation and thermal characterizations of carbon nanotube-based composites for applications in electronic packaging

Autor: R. Buttiglione, A. Di Carlo, Daniele Passeri, Federico Toschi, Marco Rossi, Maria Letizia Terranova, Emanuela Tamburri, Antonino Reale, V. Guglielmotti, A. M. Fiorello, C. Falessi

Publikováno v: ICQNM

The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelectronic devices. The variation of thermal

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::377111d6a1cacbac0cb3c1fff0d33313
http://hdl.handle.net/2108/16917

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Fabrication of RF-MEMS switches on LTCC substrates using PECVD a-Si as sacrificial layer

Autor: Anna Maria Fiorello, Romolo Marcelli, S. Catoni, Vittorio Foglietti, E. Cianci, R. Buttiglione, M. Dispenza, D. Pochesci, A. Coppa

Publikováno v: Microelectronic engineering 84 (2007): 1401–1404.
info:cnr-pdr/source/autori:Cianci E, Coppa A, Foglietti V, Dispenza M, Buttiglione R, Fiorello AM, Marcelli R, Catoni S, Pochesci D/titolo:Fabrication of RF-MEMS switches on LTCC substrates using PECVD a-Si as sacrificial layer/doi:/rivista:Microelectronic engineering/anno:2007/pagina_da:1401/pagina_a:1404/intervallo_pagine:1401–1404/volume:84

RF micromechanical switches are fabricated using dry releasing techniques. LTCC is used as substrate. Amorphous silicon, as an alternative sacrificial layer to silicon dioxide, has been used followed by dry plasma release. The silicon deposition has

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b1dfaa0f299364461ad251ba34aefbb5
http://www.cnr.it/prodotto/i/169080

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3D micro-cooled HPA package for RADAR application

Autor: Stefano Casano, Anna Maria Fiorello, Antonio Lanciano, R. Buttiglione

Publikováno v: 2006 European Microwave Conference.

A new challenging solution for an high power (75 W) module package (52mm times 52mm times 38mm) for radar application has been developed. The described module is integrated in a 3D package with an RF vertical interconnection and an embedded heat-pipe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::dfea5ec2c2659b8fcaac5ed388d588ce
https://doi.org/10.1109/eumc.2006.281186

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