Zobrazeno 1 - 10
of 26
pro vyhledávání: '"R. Beaupre"'
Autor:
Rachel H. R. Stanley, Thomas Thomas, Yuan Gao, Cassandra Gaston, David Ho, David Kieber, Kate Mackey, Nicholas Meskhidze, William L. Miller, Henry Potter, Penny Vlahos, Patricia Yager, Becky Alexander, Steven R. Beaupre, Susanne Craig, Greg Cutter, Steven Emerson, Amanda A. Frossard, Santiago Gasso, Brian Haus, William C. Keene, William M. Landing, Richard H. Moore, David Ortiz-Suslow, Jaime Palter, Fabien Paulot, Eric Saltzman, Daniel Thornton, Andrew Wozniak, Lauren Zamora, Heather Benway
The article of record may be found at https://doi.org/10.1575/1912/27821 The Surface Ocean – Lower Atmosphere Study (SOLAS) (http://www.solas-int.org/) is an international research initiative focused on understanding the key biogeochemical-physical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4fab67ad8a30eecc72f3fcaccc1bd53
https://hdl.handle.net/10945/69265
https://hdl.handle.net/10945/69265
Publikováno v:
IEEE Transactions on Electron Devices. 55:1830-1834
Time-dependent dielectric breakdown measurements were performed at 200 degC on 4H-SiC MOS capacitors and vertical DMOSFETs with 50-nm-thick nitrided oxides in order to better understand the physical mechanisms of failure and to predict the component
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b59a1f87ff578e4f3969ffefbeb2a815
https://doi.org/10.1109/ted.2008.926595
https://doi.org/10.1109/ted.2008.926595
Autor:
Peter Micah Sandvik, Greg Dunne, James Jay McMahon, Ronald J. Olson, Zachary Stum, R. Beaupre, R. Saia, V. Stolkarts, Alexander Viktorovich Bolotnikov, Yang Sui, D. Esler, A. Gowda, A. Johnson, Liangchun Yu, Michael Hartig, Stacey Kennerly, David Alan Lilienfeld, James W. Kretchmer, Peter Almern Losee, S. D. Arthur, Ljubisa Dragoljub Stevanovic, X. Zhu
Publikováno v:
2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).
In this paper, we report on 1.2kV SiC MOSFETs rated to T j, max =200°C, exhibiting improved performance characteristics across operating temperature. Our devices show stable, rugged and reliable operation when subjected to industry standard qualific
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6dfec0834263492360038d94b4efd9f8
https://doi.org/10.1109/ispsd.2014.6856035
https://doi.org/10.1109/ispsd.2014.6856035
Autor:
K. Sinha, P. McCluskey, J. Jacobsen, Abhijit Dasgupta, Peter Hansen, R. Beaupre, Moustafa Al-Bassyiouni
Publikováno v:
Volume 5: Electronics and Photonics.
When compared to temperature distributions in an actual application, thermal cycling is not a complete representation of the thermal gradients found in functional electronics under power-on condition. This discrepancy is particularly severe in power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5153bb7b56df4811c9b04a29d64b1257
https://doi.org/10.1115/imece2009-11074
https://doi.org/10.1115/imece2009-11074
Publikováno v:
Volume 6: Electronics and Photonics.
Planar metallization interconnection is an advanced approach to power module packaging. One advantage of this approach is the ability to interconnect a large number of small devices without wirebonds. The structure consists of multiple layers of diss
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77ffbeee9ecf52db7fe9e6386275323f
https://doi.org/10.1115/imece2008-67367
https://doi.org/10.1115/imece2008-67367
Autor:
Norman R. Beaupre, Robert E. Haskell, Spencer Lavan, Sandra L. Bertman, Leonard M. Fleck, Lois LaCivita Nixon, Willard P. Green, Rosa Lynn Pinkus, Joel Frader, Marilynn Rosenthal, T. Forcht Dagi, Daniel M. Fox, Erwin A. Blackstone, Norman Gevitz, William B. Bondeson
Publikováno v:
The Journal of Medical Humanities and Bioethics. 9:60-94
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a732cf65b68e1bb6ce1ae0505c3e1e7a
https://doi.org/10.1007/bf01115244
https://doi.org/10.1007/bf01115244
Akademický článek
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Conference
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