Zobrazeno 1 - 7
of 7
pro vyhledávání: '"R. A. Wachnik"'
Publikováno v:
Journal of Applied Physics. 78:3756-3768
The electromigration short‐length effect has been investigated by testing a two‐level structure with Ti‐AlCu‐Ti stripes and interlevel tungsten (W) stud vias. This investigation represents a complete study of the short‐length effect using a
Publikováno v:
Applied Physics Letters. 66:1897-1899
A paradox arises when the two‐parameter log‐normal distribution is used to predict early electromigration lifetimes of a two‐level structure with Ti–AlCu–Ti stripes and interlevel W stud‐vias. The paradox is a direct consequence of the ob
Publikováno v:
AIP Conference Proceedings.
The effect of line length on the electromigration behavior of a two-level structure with Ti-AlCu-Ti stripes and interlevel tungsten (W) stud-vias has been investigated. This investigation also represents a complete study of the short-length effect us
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 5:2131-2134
We have measured dopant distribution profiles by spreading resistance and secondary ion mass spectrometry (SIMS) as well as Schottky contact properties at Si surfaces cleaned by a high‐temperature anneal in vacuum. After sufficiently long anneal a
Publikováno v:
Journal of Applied Physics. 61:4619-4625
We have measured dopant distribution profiles by spreading resistance and secondary ion mass spectroscopy (SIMS) profiling at silicon surfaces annealed to high temperature in vacuum. Accumulation of electrically active p‐type dopants is found to oc
Publikováno v:
Journal of Applied Physics. 63:4734-4740
We have observed the onset of degradation of bipolar transistor characteristics under high current forward stress at room temperature. The observed degradation may be attributed to interface states generated next to the sidewall oxide at the emitter