Zobrazeno 1 - 2
of 2
pro vyhledávání: '"R. A. Flacker"'
Autor:
R. A. Flacker, Jacobus W. Swart, L. B. Zoccal, Silas Demmy Yamamoto, José Alexandre Diniz, E. A. Gomes, C. M. Cabreira
Publikováno v:
ECS Transactions. 9:405-414
Thin film multi layer MCM-D (Multi Chip Module Substrate) technology was developed for application on RF (radio-frequency) circuits aiming passive components (capacitors and inductors) and transmission line patterns integration. Metallic layers, usin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2bc298e636f25dbade0492a1a1fb703
https://doi.org/10.1149/1.2766912
https://doi.org/10.1149/1.2766912
Autor:
R. A. Flacker, S.D. Yamamoto, E. A. Gomes, C. M. Cabreira, Jacobus W. Swart, L. B. Zoccal, José Alexandre Diniz
Publikováno v:
2007 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference.
Thin film multilayer multi chip module technology (MCM-D) may be used to realize high quality RF (radio-frequency) passive components (capacitors and inductors) and circuits patterns (transmission lines). MCM-D structure is built with metallic and di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90ca307ce3c94b41ad6ba95eda218d79
https://doi.org/10.1109/imoc.2007.4404227
https://doi.org/10.1109/imoc.2007.4404227