Zobrazeno 1 - 10
of 275
pro vyhledávání: '"R Seetharaman"'
Publikováno v:
International Journal of Lightweight Materials and Manufacture, Vol 5, Iss 4, Pp 555-563 (2022)
Diffusion bonding is a sort of solid-state joining that allows the joining of metals with similar and dissimilar compositions by allowing them to diffuse into one another. The current study investigated the impact of process parameters on the bonding
Externí odkaz:
https://doaj.org/article/9b3e2c3ca9d84ec7b9a6e6162820ad69
Publikováno v:
Materials Today: Proceedings. 80:2394-2399
Industries are revolutionizing everyday as we step into industrial 4.0 with enhanced and smart technologies ruling every micro hub. The Information Technology industry is running with thousands of employees at once needs more power management system.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67dc83d0a8d23475b12aa84c1c06a16e
https://doi.org/10.1016/j.matpr.2021.06.369
https://doi.org/10.1016/j.matpr.2021.06.369
When it comes to the formation of controlled patterns of light, the employment of refractive freeform components is becoming an increasingly significant component. This is due to the fact that these components have the ability to spatially modulate o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b090fb1afc0f46d4da0c01710cbf4bd
Autor:
R. Seetharaman, S. Gayathri, M.V. Tejendra Prasad, H. Tamil Selvan, S. Peruvazhuthi, C. Jayakumar, A. Sivanantham
Publikováno v:
2023 International Conference on Recent Advances in Electrical, Electronics, Ubiquitous Communication, and Computational Intelligence (RAEEUCCI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd90eadc57f0d1e9970fe96dd1cba340
https://doi.org/10.1109/raeeucci57140.2023.10134384
https://doi.org/10.1109/raeeucci57140.2023.10134384
Publikováno v:
2023 Second International Conference on Electronics and Renewable Systems (ICEARS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::628548407d7d548be16505485561cb1c
https://doi.org/10.1109/icears56392.2023.10085079
https://doi.org/10.1109/icears56392.2023.10085079
Autor:
R Seetharaman, K S Lakshmi
Publikováno v:
Analytical Chemistry Letters. 12:283-291
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aee7aacabbac0d4dfd5580373c21fa61
https://doi.org/10.1080/22297928.2022.2034528
https://doi.org/10.1080/22297928.2022.2034528
Publikováno v:
Materials Today: Proceedings. 51:2218-2223
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd80063959103d186ef5ba7dad3d58ab
https://doi.org/10.1016/j.matpr.2021.11.334
https://doi.org/10.1016/j.matpr.2021.11.334
Publikováno v:
Materials Today: Proceedings. 51:2249-2253
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b82d97c0f1126f90c1c0d5d54211bfc8
https://doi.org/10.1016/j.matpr.2021.11.387
https://doi.org/10.1016/j.matpr.2021.11.387
Publikováno v:
Materials Today: Proceedings. 51:2365-2374
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6722f8b6a57e8e87fd0b72dbfaad809e
https://doi.org/10.1016/j.matpr.2021.11.582
https://doi.org/10.1016/j.matpr.2021.11.582
Publikováno v:
Materials Today: Proceedings. 51:2380-2383
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca841dc6aecc9fb6fcc547cf30616f14
https://doi.org/10.1016/j.matpr.2021.11.584
https://doi.org/10.1016/j.matpr.2021.11.584