Zobrazeno 1 - 10
of 1 089
pro vyhledávání: '"R Sai"'
Publikováno v:
Journal of Clinical and Diagnostic Research, Vol 14, Iss 5, Pp ZC13-ZC17 (2020)
Introduction: The surgical extraction of impacted mandibular third molar is a routine oral surgical procedure. However, it is often associated with post-operative inflammatory complications like pain, swelling, trismus, and discomfort during the init
Externí odkaz:
https://doaj.org/article/ee55213b2168414d856ba01e9a60e947
Autor:
B R Vijaykumar, R Sai Kant, C Rajendran, Swathi U Lekshmi, Sundar Keerthana, Anita Mahadevan, S K Shankar, R S Jayshree
Publikováno v:
Annals of Indian Academy of Neurology, Vol 21, Iss 4, Pp 250-255 (2018)
Context: Published data on genetic characterization of Toxoplasma gondii (T.gondii) from clinical cases of toxoplasmosis from India is lacking. Aims: The present study was aimed at identifying genetic types of T. gondii in fatal cases of cerebral tox
Externí odkaz:
https://doaj.org/article/d2c63387c1d045048443e245f4eb2620
Accurate identification and precise delineation of regions of significance, such as tumors or lesions, is a pivotal goal in medical imaging analysis. This paper proposes SPEEDNet, a novel architecture for precisely segmenting lesions within colonosco
Externí odkaz:
http://arxiv.org/abs/2312.01128
Autor:
Susladkar, Onkar, Makwana, Dhruv, Deshmukh, Gayatri, Mittal, Sparsh, R, Sai Chandra Teja, Singhal, Rekha
Text erasure from an image is helpful for various tasks such as image editing and privacy preservation. In this paper, we present TPFNet, a novel one-stage (end-toend) network for text removal from images. Our network has two parts: feature synthesis
Externí odkaz:
http://arxiv.org/abs/2210.14461
Autor:
Makwana, Dhruv, Nag, Subhrajit, Susladkar, Onkar, Deshmukh, Gayatri, R, Sai Chandra Teja, Mittal, Sparsh, Mohan, C Krishna
Publikováno v:
volume 13, pages 865-875, year 2022
We propose a novel deep learning model named ACLNet, for cloud segmentation from ground images. ACLNet uses both deep neural network and machine learning (ML) algorithm to extract complementary features. Specifically, it uses EfficientNet-B0 as the b
Externí odkaz:
http://arxiv.org/abs/2207.06277
Publikováno v:
Volume 142, 2022, 103720, ISSN 0166-3615
As the integration density and design intricacy of semiconductor wafers increase, the magnitude and complexity of defects in them are also on the rise. Since the manual inspection of wafer defects is costly, an automated artificial intelligence (AI)
Externí odkaz:
http://arxiv.org/abs/2207.00960
Autor:
Goud, R. Sai Prasad, Akkanaboina, Mangababu, Machiboyina, Sravani, Kumar, Kanaka Ravi, Anjum, Arshiya, Khan, Saif A., Prakash, A.P. Gnana, Pathak, A.P., Rao, S.V.S. Nageswara
Publikováno v:
In Nuclear Inst. and Methods in Physics Research, B September 2024 554
Autor:
Varghese, Ann Mary, Jayanth, R. Sai Shiva, Jacob, Remya Tressa, Srivastava, Abhishek, Pradhan, Rudra Prakash
Publikováno v:
Emerald Emerging Markets Case Studies, 2023, Vol. 13, Issue 3, pp. 1-31.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/EEMCS-04-2023-0143
Publikováno v:
In Integration May 2024 96
Autor:
Mantravadi, Ananya, Saini, Siddharth, R., Sai Chandra Teja, Mittal, Sparsh, Shah, Shrimay, R., Sri Devi, Singhal, Rekha
Publikováno v:
In Journal of Electrocardiology March-April 2024 83:41-48