Zobrazeno 1 - 10
of 15
pro vyhledávání: '"R K Raja Ibrahim"'
Publikováno v:
Journal of Physics: Conference Series. 2432:012018
Non-thermal atmospheric gas plasma is popular for its flexibility and inexpensive cost. NTP is used in food preservation, medical therapy, biotechnology, and agriculture. This study examines how atmospheric plasma jets affect honeydew seed germinatio
Autor:
Noranita Mansor, R K Raja Ibrahim
Publikováno v:
Journal of Physics: Conference Series. 1892:012033
This work aims to evaluate the sensitivity of coated FBG in measuring non-thermal plasma temperature inside a dielectric barrier discharge reactor. The FBG sensor were coated with Zinc Oxide (ZnO) and Silicon Carbide (SiC) by using magnetron sputteri
Autor:
Jose L. Cruz, Everardo Vargas-Rodriguez, E. Gallegos-Arellano, R. K. Raja-Ibrahim, A. D. Guzman-Chavez, M. Cano-Contreras
Publikováno v:
Laser Physics Letters. 13:065102
In this work a very simple continuously tunable laser based on an erbium ring cavity and a silicon wafer is presented. This laser can be tuned with very fine steps, which is a compulsory characteristic for gas sensing applications. Moreover the laser
Publikováno v:
IETE Technical Review; May/Jun2024, Vol. 41 Issue 3, p341-352, 12p
Autor:
E Gallegos-Arellano, E Vargas-Rodriguez, A D Guzman-Chavez, M Cano-Contreras, J L Cruz, R K Raja-Ibrahim
Publikováno v:
Laser Physics Letters; Jun2016, Vol. 13 Issue 6, p1-1, 1p
Publikováno v:
IEEE Transactions on Instrumentation & Measurement; 2021, Vol. 70, p1-9, 9p
Publikováno v:
IEEE Sensors Journal; Jun2021, Vol. 21 Issue 11, p12719-12733, 15p
Autor:
Yurov, V. Yu., Ralchenko, V. G., Martyanov, A. K., Antonova, I. A., Sedov, V. S., Khomich, A. A., Voronov, V. V., Savin, S. S., Shevchenko, M. Y., Bolshakov, A. P.
Publikováno v:
Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; Mar2021, Vol. 39 Issue 2, p1-12, 12p
Autor:
Sung, Jaebum, So, Hongyun
Publikováno v:
IEEE Sensors Journal; 9/15/2020, Vol. 20 Issue 18, p11007-11013, 7p
Publikováno v:
IEEE Photonics Technology Letters; 6/1/2020, Vol. 32 Issue 11, p623-626, 4p