Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Rúben F. Santos"'
Autor:
Rúben F. Santos, Bruno M. C. Oliveira, Alexandre Chícharo, Pedro Alpuim, Paulo J. Ferreira, Sónia Simões, Filomena Viana, Manuel F. Vieira
Publikováno v:
Nanomaterials, Vol 11, Iss 8, p 1914 (2021)
The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable el
Externí odkaz:
https://doaj.org/article/f15e84b333ae455992b0637a6dfb0338
Publikováno v:
Materials; Volume 16; Issue 1; Pages: 167
Ru attracted considerable attention as a candidate to replace TaN as a diffusion barrier layer for Cu interconnect metallisation. The addition of W improves the diffusion barrier properties of Ru but appears to weaken the adhesion strength between th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::de7088a82a9f32d2f65e3cd874bd6a27
Autor:
Rúben F. Santos, Bruno M. C. Oliveira, Liliane C. G. Savaris, Paulo J. Ferreira, Manuel F. Vieira
Publikováno v:
International Journal of Molecular Sciences; Volume 23; Issue 3; Pages: 1891
International Journal of Molecular Sciences, Vol 23, Iss 1891, p 1891 (2022)
International Journal of Molecular Sciences, Vol 23, Iss 1891, p 1891 (2022)
For decades, Ta/TaN has been the industry standard for a diffusion barrier against Cu in interconnect metallisation. The continuous miniaturisation of transistors and interconnects into the nanoscale are pushing conventional materials to their physic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c6759d61fb63a5a79f8158027d0e29c4
Autor:
Filomena Viana, Sónia Simões, Pedro Alpuim, Rúben F. Santos, Bruno Oliveira, Manuel F. Vieira, Paulo Ferreira, Alexandre Chicharo
Publikováno v:
Nanomaterials
Volume 11
Issue 8
Nanomaterials, Vol 11, Iss 1914, p 1914 (2021)
Volume 11
Issue 8
Nanomaterials, Vol 11, Iss 1914, p 1914 (2021)
The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2eabbd0a56515d581534eddbaa5220f0
https://hdl.handle.net/1822/81244
https://hdl.handle.net/1822/81244
Publikováno v:
Materials & Design, Vol 130, Iss, Pp 263-274 (2017)
This work aims to obtain multifunctional nanocomplexes with a superparamagnetic core and an upconversion luminescent shell, by synthesizing superparamagnetic iron oxide nanoparticles (SPIONs) functionalized with lanthanide ions. These materials may b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::83e27504d76368aa3982d0a5a5033438
http://www.sciencedirect.com/science/article/pii/S0264127517305452
http://www.sciencedirect.com/science/article/pii/S0264127517305452
Publikováno v:
Microporous and Mesoporous Materials. 232:227-237
A streamlined synthesis approach is proposed to develop a multifunctional magnetite doped hybrid silica aerogel by taking advantage of the versatility of the sol-gel process and flexibility of the crosslinking reaction. To this avail, magnetite NPs,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06731153c612095ee0fc17f4054d6347
https://doi.org/10.1016/j.micromeso.2016.06.025
https://doi.org/10.1016/j.micromeso.2016.06.025
Autor:
Rúben F. Santos, F. Viana
Publikováno v:
Microscopy and Microanalysis. 21:98-99
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30d050a15ad92bce7f187c36b6f19e32
https://doi.org/10.1017/s1431927614014196
https://doi.org/10.1017/s1431927614014196
Publikováno v:
AIP Conference Proceedings.
In this work, the thermal behavior of Fe2O3/Al thermite mixtures, in air and vacuum, is studied. The individual reactants and three mixtures — stoichiometric and over aluminized — are tested, by Simultaneous Thermal Analysis (STA) and heating mic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c83c6d8a9a01bc2b585f41224e90a90d
https://doi.org/10.1063/1.2263480
https://doi.org/10.1063/1.2263480
Publikováno v:
Microscopy and Microanalysis. 14:17-18
Continuously miniaturization of electronic components using PCB's technology for the manufacturing of SDRAM's uses a solder ball attach process, producing a joint which robustness and electrical response are crucial factors to success. At present, ne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22e4c24547eaaed05079be67431341ec
https://doi.org/10.1017/s1431927608089253
https://doi.org/10.1017/s1431927608089253
Publikováno v:
Applied Sciences, Vol 12, Iss 19, p 9778 (2022)
The development of new materials for the electronics industry has been in focus in recent years, as circuit miniaturization poses challenges for conventional solutions. Dewetting of Cu films over diffusion-barrier layers has fostered an interest in d
Externí odkaz:
https://doaj.org/article/9b1a7a411df24590ba9a769ad567eafe