Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Quanwen Wang"'
Publikováno v:
Fractal and Fractional, Vol 7, Iss 12, p 887 (2023)
Chaos-based image encryption has become a prominent area of research in recent years. In comparison to ordinary chaotic systems, fractional-order chaotic systems tend to have a greater number of control parameters and more complex dynamical character
Externí odkaz:
https://doaj.org/article/c2f62001ddaf4ce8baaf405017b03151
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2090 (2023)
Nowadays, the utilization of memristors to enhance the dynamical properties of chaotic systems has become a popular research topic. In this paper, we present the design of a novel 2D memristor-enhanced polynomial hyper-chaotic map (2D-MPHM) by utiliz
Externí odkaz:
https://doaj.org/article/e75bb31297d44ac8ad35bccbc480f2a5
Publikováno v:
Procedia Computer Science. 203:367-374
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a6412b01ebe5190044397e7cdbc3cfc
https://doi.org/10.1016/j.procs.2022.07.047
https://doi.org/10.1016/j.procs.2022.07.047
Publikováno v:
Vascular. 30:825-833
Objective The objective is to investigate whether percutaneous access (pEVAR) is superior to cutdown access (cEVAR) in terms of safety and efficacy during endovascular repair of abdominal aortic aneurysms (AAAs). Methods We searched PubMed, Embase, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::72aa878445bb88bfaedc31c632efaeec
https://doi.org/10.1177/17085381211032765
https://doi.org/10.1177/17085381211032765
Publikováno v:
2021 IEEE 5th Conference on Energy Internet and Energy System Integration (EI2).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b376ea022a2d7a60c7aa17a547f0165b
https://doi.org/10.1109/ei252483.2021.9713547
https://doi.org/10.1109/ei252483.2021.9713547
Autor:
Dezhi Su, Huihui Yang, Peijie Guan, Cen Wang, Quanwen Wang, Dan Zhao, Yucheng Niu, Shangzhi Wang
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
In this paper 3968 bumps were successfully bonded by flip chip method. Then the solder joints of flip chip underwent harsh temperature cycling testing. Industry computed tomography (ICT), optical microscope (OM), scanning electron microscope (SEM) an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7363074c3af3dba026287b4b03193e42
https://doi.org/10.1109/icept47577.2019.245284
https://doi.org/10.1109/icept47577.2019.245284
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
In this paper the bonding effect of thin Al wire was investigated with different states of capillary tip. Simulation method was used to provide the cloud map for stress distribution in the bonding process. Optical microscopy (OM) and scanning electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99390f870a1f2013a7b4c7209f3ad355
https://doi.org/10.1109/icept.2018.8480546
https://doi.org/10.1109/icept.2018.8480546