Zobrazeno 1 - 10
of 212
pro vyhledávání: '"Quad Flat Package"'
Autor:
L. C. Tan, Mohd Faizul Mohd Sabri, Andri Andriyana, D. Zhou, B. Y. Low, A.S.M.A. Haseeb, Yew Hoong Wong, X. S. Pang, P. L. Eu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:435-443
Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and
Akademický článek
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Autor:
X. S. Pang, A.S.M.A. Haseeb, Andri Andriyana, B. Y. Low, Yew Hoong Wong, L. C. Tan, Mohd Faizul Mohd Sabri, D. Zhou, P. L. Eu
Publikováno v:
Materialwissenschaft und Werkstofftechnik. 51:1353-1363
Publikováno v:
Microsystem Technologies. 26:3011-3021
Thermo mechanical fatigue and damage have been always an issue for solder joint materials used in microelectronics. Accurate damage and crack prediction is important to define the life cycle of these joints. This paper provides a finite element model
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science. 234:4277-4287
An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain,
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Electronic devices often work under a variety of vibration loads, especially for aerospace devices. For this reason, the reliability under vibration loading has become a critical problem of modern electronic devices. In recent years, the finite eleme
Publikováno v:
Soldering & Surface Mount Technology. 32:1-9
Purpose The purpose of this paper is to investigate and minimize the printing-related defects in the surface mount assembly (SMA) process. Design/methodology/approach This paper uses an experimental approach to explore process parameter and printing
Autor:
Chien-Yi Huang
Publikováno v:
Soldering & Surface Mount Technology. 30:217-226
Purpose This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the desired inspection specification is determined to reduce the exp
Autor:
Jia-Shen Lan, Mei-Ling Wu
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In this research, the delamination issue in the Quad Flat Package (QFP) after molding and post-mold cure processes is investigated through experiments and simulation modeling. The delamination failure is occurred at the interface between the Cu pad a
Akademický článek
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