Zobrazeno 1 - 10
of 1 013
pro vyhledávání: '"Quad Flat No-leads package"'
Autor:
Nelson Rodrigues, Senhorinha F. C. F. Teixeira, Ana Lima, Violeta Carvalho, Duarte Nuno Vieira, Hélder Puga, Duarte Santos, José A. Teixeira
Publikováno v:
Journal of Electronic Materials. 51:273-283
The exposure of miniaturized components to the environment leads to new failure analysis as a result of environmental conditions and constant innovation of the component materials and dimensions. Generally, these failures occur on the solder joints,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2af48873b31fb057e3a798939f363e6
https://doi.org/10.1007/s11664-021-09232-9
https://doi.org/10.1007/s11664-021-09232-9
Publikováno v:
Journal of Surface Mount Technology. 34:16-22
Tire Pressure Monitoring Systems (TPMS) are electronic wireless systems that monitor and report air pressure inside pneumatic tires in real time. An example of a TPMS module integrated with the valve stem and showing the typical tire mounting locatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50f84b5a905f2d7614d841b4f2680bdf
https://doi.org/10.37665/smt.v34i2.20
https://doi.org/10.37665/smt.v34i2.20
Publikováno v:
Journal of Engineering Research and Reports. :7-12
Modification and improvement of an existing tooling design in semiconductor packaging industry has been a usual practice, to enhance the current setup and to provide a solution to a specific assembly problem. This paper discusses the solution in elim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::911bdf4df55ba996f35bcf604d957c46
https://doi.org/10.9734/jerr/2021/v20i917369
https://doi.org/10.9734/jerr/2021/v20i917369
Publikováno v:
Journal of Engineering Research and Reports. :110-115
Glass material used on a semiconductor device for isolating currents are one of the new breakthroughs of the modern world. Challenges are inevitable due to its complex characteristics and unique appearance. The study focuses on the phenomenon of reje
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad0c10398607a65f7762eea8ad85570d
https://doi.org/10.9734/jerr/2021/v20i817365
https://doi.org/10.9734/jerr/2021/v20i817365
Publikováno v:
Journal of Engineering Research and Reports. :97-103
The integrity of the assembly wirebond process’ 2nd bond poses a big challenge for semiconductor manufacturing of quad-flat no-leads (QFN) devices, particularly on multiple wires on a lead. These devices are vulnerable to induce or obtain broken wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba196185686ef968aa947d06e2868867
https://doi.org/10.9734/jerr/2021/v20i817363
https://doi.org/10.9734/jerr/2021/v20i817363
Publikováno v:
Journal of Engineering Research and Reports. :18-21
The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::322f68ccdb974ff669d16683f85bfbca
https://doi.org/10.9734/jerr/2021/v20i817353
https://doi.org/10.9734/jerr/2021/v20i817353
Publikováno v:
Journal of Engineering Research and Reports. :109-114
Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is consider
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::245425b98b1c2ce4239f978a7e56326d
https://doi.org/10.9734/jerr/2021/v20i617333
https://doi.org/10.9734/jerr/2021/v20i617333
Publikováno v:
Journal of Engineering Research and Reports. :52-56
Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21845beb94a03eb8e1c9e916c1320b97
https://doi.org/10.9734/jerr/2021/v20i617326
https://doi.org/10.9734/jerr/2021/v20i617326
Autor:
Jia-Shen Lan, Mei-Ling Wu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:785-792
In this research, finite-element analysis and failure analysis were performed to analyze delamination failure in quad flat no-lead (QFN) packages. Although a QFN is a traditional package and represents mature technology, the reliability standards of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bef9db3316467d417b7296d991a5c66c
https://doi.org/10.1109/tcpmt.2021.3066790
https://doi.org/10.1109/tcpmt.2021.3066790
Publikováno v:
Journal of Engineering Research and Reports. :37-40
Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a sati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e92c98fa7a046c8449106ae748cf8a1
https://doi.org/10.9734/jerr/2021/v20i517309
https://doi.org/10.9734/jerr/2021/v20i517309