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pro vyhledávání: '"Qizhuo Li"'
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
Computers in Biology and Medicine. 158:106872
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Data-centric computing including data analytics, machine learning and AI is the main driving force for high-end performance 3D microelectronic packaging. TSV -based technology has enabled the Foveros 3D packaging from Intel, the 3D system integration
Autor:
Xiaoting Luo, Zhiheng Huang, Shuanjin Wang, Min Xiao, Yuezhong Meng, Hui Yan, Qizhuo Li, Gang Wang
Publikováno v:
Electronics, Vol 11, Iss 221, p 221 (2022)
Electronics; Volume 11; Issue 2; Pages: 221
Electronics; Volume 11; Issue 2; Pages: 221
As thermal management in 3DIC integration becomes increasingly important in advanced semiconductor node processes, novel experimental and modeling approaches are in great demand to reveal the critical material issues involving multiscale microstructu
Publikováno v:
NeuroImage. 172
Despite numerous studies on age-related changes in static functional connections (FCs), the available literature on the changes in dynamic FCs with aging is lacking. This study investigated the changes in dynamic FCs with aging based on resting state