Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Qing-Lun Chen"'
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 25:1696-1704
A newly developed method is introduced in this paper to efficiently model frequency-dependent on-die pad capacitance and conductance, which can be easily integrated in computer-aided-design tools. An equivalent lumped circuit is used to model the pad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3d9a6368a659da3548d2b1d443b8d12
https://doi.org/10.1109/tcad.2005.858263
https://doi.org/10.1109/tcad.2005.858263
Publikováno v:
IEEE MTT-S International Microwave Symposium Digest, 2003.
It is well known that on-die bonding pad capacitance and conductance is quite frequency-dependent due to the existence of lossy substrate. This paper describes a very simple yet accurate method to determine them. The pad capacitance is divided into t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f3bef0d7134d9caddd75eb14343abae
https://doi.org/10.1109/mwsym.2003.1212500
https://doi.org/10.1109/mwsym.2003.1212500
Publikováno v:
Electrical Performance of Electronic Packaging.
This paper describes a novel decoupling capacitor attachment method, which can promptly guide engineers to select the optimal value of decoupling capacitors to suppress low, middle and high frequency noise for board/package/system design. Analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::881f2f47efdc564d180640508314ff85
https://doi.org/10.1109/epep.2002.1057913
https://doi.org/10.1109/epep.2002.1057913
Autor:
Qing-lun Chen, Jin Zhao
Publikováno v:
IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).
With the increase in digital signal bus speeds and fast rise time signals, small discontinuities like via and nonnormal return path on a bus are becoming more important factors for signal quality and timing. A long via has higher input impedance than
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::343677ea7a63c0a38f1994638054445f
https://doi.org/10.1109/epep.2000.895531
https://doi.org/10.1109/epep.2000.895531
Publikováno v:
Electrical Performance of Electronic Packaging,; 2002, p191-194, 4p
Autor:
Jin Zhao, Qing-lun Chen
Publikováno v:
IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524); 2000, p155-158, 4p
Conference
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Publikováno v:
IEEE MTT-S International Microwave Symposium Digest, 2003; 2003, p837-837, 1p