Preparation strategy for low-stress and uniform SiC-on-diamond wafer: A silicon nitride dielectric layer

Autor: Zheng, Yuting, Zhang, Qinrui, Qiao, Guanzhong, Wei, Junjun, Liu, Jinlong, Chen, Liangxian, An, Kang, Zhang, Xiaotong, Ye, Haitao, Zhou, Haojun, Tao, Hongliang, Yin, Yuhang, Ouyang, Xiaoping, Li, Chengming

Publikováno v: In Ceramics International 15 December 2022 48(24):36441-36449

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A global bibliometric and visualized analysis of gait analysis and artificial intelligence research from 1992 to 2022.

Autor: Bao T; School of Medicine, Tsinghua University, Beijing, China.; Institute for Precision Medicine, Tsinghua University, Beijing, China.; Orthopedics Department of the First Affiliated Hospital of Tsinghua University, Beijing, China., Gao J; Institute for AI Industry Research, Tsinghua University, Beijing, China., Wang J; School of Medicine, Tsinghua University, Beijing, China.; Orthopedics Department of the First Affiliated Hospital of Tsinghua University, Beijing, China., Chen Y; Orthopedics Department of the First Affiliated Hospital of Tsinghua University, Beijing, China., Xu F; Orthopedics Department of the First Affiliated Hospital of Tsinghua University, Beijing, China., Qiao G; Orthopedics Department of the First Affiliated Hospital of Tsinghua University, Beijing, China., Li F; Institute for Precision Medicine, Tsinghua University, Beijing, China.; Orthopedics Department of the First Affiliated Hospital of Tsinghua University, Beijing, China.

Publikováno v: Frontiers in robotics and AI [Front Robot AI] 2023 Nov 17; Vol. 10, pp. 1265543. Date of Electronic Publication: 2023 Nov 17 (Print Publication: 2023).