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pro vyhledávání: '"Qianye Xu"'
Publikováno v:
Journal of Alloys and Compounds. 675:317-324
We studied the diffusion bonding mechanism and interfacial reactions between sintered nanosilver and direct-bond-copper substrates with different surface finishes, i.e., electroless nickel immersion gold (ENIG) and electroplated nickel gold (Ni/Au).