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Rapid Deployment of Antiviral Drugs Using Single-Virus Tracking and Machine Learning.

Autor: Zhu MD; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Shi XH; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Wen HP; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Chen LM; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Fu DD; College of Chemistry and Molecular Sciences, Wuhan University, Wuhan 430072, P. R. China., Du L; College of Chemistry and Molecular Sciences, Wuhan University, Wuhan 430072, P. R. China., Li J; College of Chemistry and Molecular Sciences, Wuhan University, Wuhan 430072, P. R. China., Wan QQ; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Wang ZG; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Yu C; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Pang DW; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China., Liu SL; State Key Laboratory of Medicinal Chemical Biology, Frontiers Science Center for New Organic Matter, Tianjin Key Laboratory of Biosensing and Molecular Recognition, Research Center for Analytical Sciences, College of Chemistry, School of Medicine and Frontiers Science Center for Cell Responses, Nankai University, Tianjin 300071, P. R. China.

Publikováno v: ACS nano [ACS Nano] 2024 Dec 18. Date of Electronic Publication: 2024 Dec 18.

Fabrication and performance enhancement of an In 2 O 3 /BiVO 4 heterojunction for N -butanol gas sensing applications.

Autor: Li XB; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Sun S; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Hu X; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Zhang QQ; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Gao C; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Zhou H; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Wu BX; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Wang AQ; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Hu WY; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Wang YJ; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Yang LX; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Yang B; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Li WK; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn., Xu HH; Engineering Research Center of Integrated Circuit Packaging and Testing, Ministry of Education, Department of Physics, Tianshui Normal University Tianshui Gansu 741001 China lixiangbing@tsnu.edu.cn.

Publikováno v: RSC advances [RSC Adv] 2024 Dec 17; Vol. 14 (53), pp. 39715-39726. Date of Electronic Publication: 2024 Dec 17 (Print Publication: 2024).