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Publikováno v:
Acta Horticulturae. :353-357
Publikováno v:
Acta Horticulturae. :343-351
Publikováno v:
Materials Science and Engineering: R: Reports. 16:43-96
Silicides are widely used in silicon integrated circuits as contacts and interconnections. In many applications silicides are used on polycrystalline silicon (polysilicon) such as the gates of FETs and the emitter of bipolar transistors. The use of s
Autor:
J. W. Mayer, Q.Z Hong
Publikováno v:
Thin Solid Films. 223:235-241
Solid phase epitaxy (SPE) of GexSi1−x(0.25 ⩽ x ⩽ 0.67) on (111) Si has been achieved by utilizing an intermediate Pd2Si layer. On annealing a deposited GeSi/Pd2Si/Si substrate sample in the temperature range 550–750 °C, the deposited GeSi
Autor:
Q.Z. Hong, Li Jian, S. Mantl, S.S. Lau, J. W. Mayer, R. Butz, Bernhard Holländer, B. Zhu, C. Cozzolino, G. Vizkelethy, S.N. Hsu, W. Xia
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. :989-993
Thermal interdiffusion in Si/Ge layered structures shows large variations in diffusivity between Si/Ge amorphous multilayer films and symmetrically strained superlattice structures. Amorphous layered structures exhibit much higher diffusivities and m
Publikováno v:
IEEE Electron Device Letters. 19:151-153
A novel Ti self-aligned silicide (salicide) process using a combination of low dose molybdenum and preamorphization (PAI) implants and a single rapid-thermal-processing (RTP) step is presented, and shown to be the first Ti salicide process to achieve
Autor:
Q.Z. Hong, Jorge A. Kittl, G.A. Dixit, P.P. Apte, Amitava Chatterjee, Ih-Chin Chen, Douglas A. Prinslow
Publikováno v:
Proceedings of Technical Papers. International Symposium on VLSI Technology, Systems, and Applications.
Publikováno v:
International Electron Devices Meeting. Technical Digest.
A high performance 1.5 V, sub-0.18 /spl mu/m (physical) gate length CMOS technology and extension to a 1.0 V technology for low power applications is described. nMOS with nominal I/sub drive/=740, 580, and 380 /spl mu/m are achieved for V/sub DD/=1.8
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. :414-419
It is well established that strong correlations exist in thermal annealing and ion mixing. Recent investigations show pronounced differences between the two processes, even if the mixing is performed in the thermally activated regime. The growth kine