Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Q. Hubert"'
Autor:
Philippe Lentrein, Matthias Vidal-Dho, Q. Hubert, Pascal Fornara, Jean-Michel Moragues, Patrice Ray, Bernard Pelissier, Patrice Gonon
Publikováno v:
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS), May 2020, Edinburgh, United Kingdom. pp.1-4, ⟨10.1109/ICMTS48187.2020.9107909⟩
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS), May 2020, Edinburgh, United Kingdom. pp.1-4, ⟨10.1109/ICMTS48187.2020.9107909⟩
This paper presents a novel methodology to observe the leakage current origin in SiOC:H low-$\kappa$ intermetallic dielectric as well as a method to localise electrically the breakdown point in usual comb/serpentine/comb structures. Our results indic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bb1d8bff7790288ec93dd1af810fd697
https://hal.univ-grenoble-alpes.fr/hal-02916807
https://hal.univ-grenoble-alpes.fr/hal-02916807
Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material
Autor:
Jean-Luc Ogier, Pascale Potard, Matthias Vidal-Dho, Bernard Pelissier, Q. Hubert, Jean-Philippe Escales, Pascal Fornara, Patrice Gonon, Jean-Michel Moragues
Publikováno v:
2019 IEEE International Integrated Reliability Workshop (IIRW).
This paper presents an in depth study of the moisture influence on reliability and electrical characteristics of SiOC:H low-κ dielectric material. Firstly, TDDB models have been evaluated on material without moisture and Impact Damage model is found
Autor:
Patrice Gonon, Pascale Potard, Jean-Michel Mirabel, Jonathan Jacquot, Delphine Maury, Jean-Philippe Escales, Maxime Marchetti, Q. Hubert, Pascal Fornara, Olivier Pizzuto, Matthias Vidal-Dho, Philippe Delorme, Pascal Sallagoity, Jean-Michel Moragues, Ludovic Beauvisage
Publikováno v:
Conf. on Microelectronic Test Structures (ICMTS)
Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp.176-179
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS)
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp 176-179
Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp.176-179
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS)
IEEE Int. Conf. on Microelectronic Test Structures (ICMTS), 2019, Kita-Kyushu, Japan. pp 176-179
This paper underlines the damages induced by probing on narrow pads reliability of specifically designed test structures placed on dicing streets and indicates that probing during electrical test steps provokes detrimental cracks diving from the pass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a3ee63e3a5c25ae9fef6997ba49f793
https://hal.univ-grenoble-alpes.fr/hal-02362746
https://hal.univ-grenoble-alpes.fr/hal-02362746
Autor:
Q. Hubert, M. Mantelli, Y. Escarabajal, B. Duclaux, S. Audran, V. Arnal, Francois Maugain, Frederique Trenteseaux, E. Lepape, Abderrezak Marzaki, F. Baudin, Julien Delalleau, A. Champenois, D. Galpin, E. Beche, L. Baron, L. Parmigiani, Giada Ghezzi, Pascal Gouraud, F. La Rosa, Stephan Niel, Arnaud Regnier, B. Saidi, N. Cherault, T. Cabout
Publikováno v:
2018 IEEE International Electron Devices Meeting (IEDM)
This paper discusses an innovative architecture of charge storage NVM cell, which outpaces state-of-the-art in term of bit-cell area. This new concept of memory cell is used today in production for microcontrollers. After cell architecture and activa
Autor:
François H. Julien, Q. Hubert, B. Rebuffat, L. Masoero, M. Carmona, J. Innocenti, P. Chiquet, Pascal Masson, L. Lopez
Publikováno v:
Solid-State Electronics. 111:52-57
In this paper, carrier effective mobility is accurately extracted from weak to strong inversion and from ohmic to saturation regimes by pairing the split C – V technique with charge-sheet model. In weak inversion, both electron and hole effective m
Publikováno v:
IEEE Transactions on Electron Devices. 60:2268-2275
In this paper, we show that performances of Ge2Sb2Te5-based phase-change memory (PCM) cells can be improved by the insertion of a thin HfO2 interfacial layer between the phase-change material and the tungsten plug. Significant reduction of the RESET
Publikováno v:
IEEE Transactions on Electron Devices. 59:188-196
The physical mechanisms that regulate carrier transport in polycrystalline chalcogenides, such as Ge2Sb2Te5 (GST), are still debated. Recently, self-induced Joule-heating (SJH) effect has been claimed to be the key factor in explaining the nonlineari
Autor:
G. Bouton, François H. Julien, Stephan Niel, Q. Hubert, J. Innocenti, Pascal Fornara, A. Regmer, J.-M. Portal, C. Rivero, L. Lopez, Pascal Masson
Publikováno v:
2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).
This paper presents a new solution to reduce the mechanical stress impact of Shallow Trench Isolation (STI) by adding polysilicon in STI and thus, improve MOSFET performances. Indeed, when a polysilicon wall is used, the drive current of NMOS transis
Autor:
Stephan Niel, Pascal Masson, Q. Hubert, Jacques Sonzogni, Arnaud Regnier, Franck Julien, J-M. Portal, L. Lopez, J. Innocenti
Publikováno v:
MIPRO
This paper presents several layout optimizations in order to decrease both, the internal power and the area of digital standard cells. A new D flip-flop (Dff) is designed using advanced design rules and lower active widths. Post-layout simulations ar
Publikováno v:
2014 29th Symposium on Microelectronics Technology and Devices (SBMicro).
In this paper, analog and digital low-voltage MOSFETs having the gate contact over Shallow Trench Isolation (reference layout) or over active area (innovative layout) are studied. Using electrical parameters measurements, Linear Ramp Voltage Stress a