Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Pylin Sarobol"'
Publikováno v:
Scripta Materialia. 187:458-463
Two grain boundaries (GBs) in a Sn-alloy film exhibited different morphological changes during thermal cycling: whisker growth and GB sliding. Along GB-I, pervasive nucleation of high-angle and low-angle GBs occurred, with whisker growth of some shal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb2a43e113ea7a81589dd1cf81ec6ccb
https://doi.org/10.1016/j.scriptamat.2020.06.033
https://doi.org/10.1016/j.scriptamat.2020.06.033
Autor:
David Edgar Beatty, R. A. Kellogg, Andrew Vackel, Donald Francis Susan, Bonnie Beth McKenzie, Todd Huber, Jay Carroll, Pylin Sarobol, Bradley Salzbrenner
Publikováno v:
Proposed for presentation at the IMAT 2020 - Virtual Edition held October 26-28, 2020..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9faa38c0742759e4e06568e7af36f091
https://doi.org/10.2172/1831041
https://doi.org/10.2172/1831041
Publikováno v:
JOM. 68:2888-2899
Four different types of stress relaxation responses have been observed in terms of local microstructural changes along grain boundaries (GBs) in large-grained high-Sn (Sn-3.0Ag-0.5Cu) solder films after thermal cycling. The grain boundaries were char
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ae5242b4e46fce68d22caac971566cb
https://doi.org/10.1007/s11837-016-2070-3
https://doi.org/10.1007/s11837-016-2070-3
Autor:
David M. Keicher, Paul G. Clem, Adam Cook, Nelson S. Bell, Aaron Christopher. Hall, Deidre A. Hirschfeld, Pylin Sarobol
Publikováno v:
Annual Review of Materials Research. 46:41-62
There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca65431d29c98d7983b871382be8ed4a
https://doi.org/10.1146/annurev-matsci-070115-031632
https://doi.org/10.1146/annurev-matsci-070115-031632
Autor:
Jay Carroll, William M. Mook, Khalid Hattar, Aaron Christopher. Hall, Pylin Sarobol, Daniel Charles Bufford, Michael Chandross, Paul G. Kotula, Brad L. Boyce
Publikováno v:
Journal of Thermal Spray Technology. 25:82-93
Aerosol deposition (AD) is a solid-state deposition technology that has been developed to fabricate ceramic coatings nominally at room temperature. Sub-micron ceramic particles accelerated by pressurized gas impact, deform, and consolidate on substra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e449a3fa93df28acdd4508e9c81e23ec
https://doi.org/10.1007/s11666-015-0295-2
https://doi.org/10.1007/s11666-015-0295-2
Publikováno v:
Journal of Materials Research. 29:197-206
A strategy for identifying the preferred sites and overall propensity of a Sn film to form whiskers has been developed based on film textures, local grain orientations, and elastic strain energy densities (ESEDs), with preferred sites predicted to be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e37eeb4b3b363375b430c552e5b09c6
https://doi.org/10.1557/jmr.2013.378
https://doi.org/10.1557/jmr.2013.378
A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties
Autor:
Pylin Sarobol, John E. Blendell, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, Carol A. Handwerker, John P. Koppes
Publikováno v:
Mitigating Tin Whisker Risks
Whisker and hillock formation in thin films is well known as a highly local mechanism for stress relaxation, where in many cases, only a few whiskers form out of thousands of grains in a film. In this article, the microstructural characteristics for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::879895149fd1c3079bbc1dbf8de0a7e0
https://doi.org/10.1007/s11837-013-0717-x
https://doi.org/10.1007/s11837-013-0717-x
Publikováno v:
Materials Letters. 99:76-80
Direct evidence was obtained for the nucleation of surface grains through recrystallization and their growth into whiskers and hillocks during thermal cycling of Sn-alloy films. Shallow grains with low dislocation densities nucleated at pre-existing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5f79904e5ff3b51350e1c53e8ae6f2a
https://doi.org/10.1016/j.matlet.2013.02.066
https://doi.org/10.1016/j.matlet.2013.02.066
Publikováno v:
Acta Materialia. 61:1991-2003
A model incorporating the effects of grain geometry and size and grain boundary properties on the growth of whiskers and hillocks has been developed based on coupling between localized Coble creep and grain boundary sliding. For both whiskers and hil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a73d33a3c12d00447c8d4dccb316d0a
https://doi.org/10.1016/j.actamat.2012.12.019
https://doi.org/10.1016/j.actamat.2012.12.019
Autor:
Peng Su, Pylin Sarobol, John E. Blendell, Carol A. Handwerker, Aaron E. Pedigo, Wei-Hsun Chen
Publikováno v:
Journal of Materials Research. 28:747-756
A whisker and hillock growth model based on local film microstructure, grain misorientation, and elastic strain energy density (ESED) as the driving force for growth was developed to predict preferred sites for growth. Local grain orientations and st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5f5d552210bec13a3146bd025c2c8f5
https://doi.org/10.1557/jmr.2012.430
https://doi.org/10.1557/jmr.2012.430