Zobrazeno 1 - 10
of 147
pro vyhledávání: '"Puqi Ning"'
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 8, Iss 3, Pp 332-346 (2024)
In the current vehicle electric propulsion systems, the thermal design of power modules heavily relies on empirical knowledge, making it challenging to effectively optimize irregularly arranged Pinfin structures, thereby limiting their performance. T
Externí odkaz:
https://doaj.org/article/2417d91436ab441e8aa4e1bca79a0d28
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 8, Iss 1, Pp 72-79 (2024)
Silicon carbide (SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper (DBC) uni
Externí odkaz:
https://doaj.org/article/2113d3dd4ad7441fab5690b5265356f4
Autor:
Jiaxiao Wang, Tingting Zuo, Jiangli Xue, Yadong Ru, Yue Wu, Zhuang Xu, Yongsheng Liu, Zhaoshun Gao, Puqi Ning, Tao Fan, Xuhui Wen, Li Han, Liye Xiao
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 8, Iss 1, Pp 80-85 (2024)
High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr 3 C 2 phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw mater
Externí odkaz:
https://doaj.org/article/8c2b8a71d7c54d879f22fa86569f0f9f
Publikováno v:
CSEE Journal of Power and Energy Systems, Vol 10, Iss 4, Pp 1799-1807 (2024)
Compared to Si devices, the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material. This paper proposes a practical SiC MOSFET junction temperature monit
Externí odkaz:
https://doaj.org/article/92a5e615a6e742c9ab2a29528746a92c
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 1, Iss 4, Pp 360-366 (2017)
A compact wirebond packaged phase-leg SiC/Si hybrid module was designed, developed, and tested. Details of the layout and gate drive designs are described. The IC chip for gate drive is carefully selected and compared. Dual pulse test confirmed that,
Externí odkaz:
https://doaj.org/article/489945173c264070ac6e51b235492c64
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 1, Iss 4, Pp 411-417 (2017)
The layout of power modules is one of the key points in power module design, especially for silicon carbide module, which may parallel more devices compared with silicon counterpart. In this paper, along with the design example, a improved layout des
Externí odkaz:
https://doaj.org/article/90e9093e833f451fb39add4d3754b92c
Publikováno v:
World Electric Vehicle Journal, Vol 12, Iss 4, p 186 (2021)
At present, the DC busbar design is one of the bottlenecks restricting the improvement of the power density of motor drives. Therefore, this paper proposes a three-dimensional line probe algorithm, which can realize the automatic routing of laminated
Externí odkaz:
https://doaj.org/article/028a34e2293f4287b0b0884ca01152b3
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 1, Iss 3, Pp 231-237 (2017)
Along with the rapid growth in electric vehicle (EV) market, higher power density and more efficient motor drive inverters are required. It is well known that silicon carbide (SiC) has advantages of high temperature, high efficiency and high switchin
Externí odkaz:
https://doaj.org/article/92e0f21fa73448479380376cf87aecad
Publikováno v:
Chinese Journal of Electrical Engineering. 8:104-112
Publikováno v:
Chinese Journal of Electrical Engineering. 7:73-78
In this paper, an offline evaluation method for the cooling capability of three-phase insulated-gate bipolar transistor (IGBT) inverters is presented, which can better emulate real working conditions. With a properly designed sudden-stop control sequ