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Autor:
Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bfc9d5842152a69dff95d767963e05a
https://doi.org/10.1109/ectc.2018.00222
https://doi.org/10.1109/ectc.2018.00222
