Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Pubudu Goonetilleke"'
Autor:
Shubhada H. Sahasrabudhe, Scott Mokler, Owen Jin, Nilesh Badwe, Pubudu Goonetilleke, Eric Brigham, Kevin Byrd, Satish Parupalli, Sandeep B. Sane, M. Renavikar
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Intel's commitment to the environment continues with a breakthrough technology – Low Temperature Solder for Surface Mounted Devices. In this paper we will introduce the technology and its benefits to PC and electronic device manufacturers. We will
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bfc9d5842152a69dff95d767963e05a
https://doi.org/10.1109/ectc.2018.00222
https://doi.org/10.1109/ectc.2018.00222
Publikováno v:
Printed Circuit Design & Fab: Circuits Assembly; Feb2020, Vol. 37 Issue 2, p50-55, 6p
Publikováno v:
Printed Circuit Design & Fab: Circuits Assembly; May2023, Vol. 40 Issue 5, p64-65, 2p
Autor:
Babu Suryadevara
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The techno
