Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Przemyslaw Gromala"'
Autor:
Bart Vandevelde, Riet Labie, Ralph Lauwaert, Rainer Dudek, Przemyslaw Gromala, Michael Eichorst
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb036dc1720277aed4d5d75030e9f27b
https://doi.org/10.1109/eurosime56861.2023.10100841
https://doi.org/10.1109/eurosime56861.2023.10100841
Publikováno v:
Journal of Electronic Packaging. 145
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30cbe3f5afec023dc9f59b20f3b3951f
https://doi.org/10.1115/1.4056558
https://doi.org/10.1115/1.4056558
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::627f96bf4f7ba90986310d22d06cf821
https://doi.org/10.1109/ectc51906.2022.00231
https://doi.org/10.1109/ectc51906.2022.00231
Autor:
Bart Vandevelde, Chinmay Nawghane, Rainer Dudek, Ralf Doring, Jens Schindele, Przemyslaw Gromala
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5890fcacf82d6d5df6040a52b385e6c
https://doi.org/10.1109/eurosime54907.2022.9758850
https://doi.org/10.1109/eurosime54907.2022.9758850
Autor:
Jingyao Sun, Dhruvit Gabani, Christian Silber, Franz Dietz, Alexander Kabakchiev, Przemyslaw Gromala, Roland Thewes, Goran Pecanac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b746723fd6a2fd3aa694e1154b7a9089
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85130508790
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85130508790
