Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Przemysław Smakulski"'
Publikováno v:
International Journal of Numerical Methods for Heat & Fluid Flow. 30:3005-3025
Purpose This paper aims to describe and investigate the mathematical models and numerical modeling of how a cell membrane is affected by a transient ice freezing front combined with the influence of thermal fluctuations and anisotropy. Design/methodo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4ee1cd0d25d8d4435004eaa0b6a0c1e
https://doi.org/10.1108/hff-12-2018-0740
https://doi.org/10.1108/hff-12-2018-0740
Publikováno v:
International Journal of Heat and Mass Transfer. 184:122253
The qualitative mechanism of heat transfer during the cooling process by spraying M icro- S olid N itrogen (MSN2) together with the capability to vitrify a large-volume of samples is experimentally investigated in the article. The experiments were ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ccf9cb0bca986de46cecc160ca815b4
https://doi.org/10.1016/j.ijheatmasstransfer.2021.122253
https://doi.org/10.1016/j.ijheatmasstransfer.2021.122253
Publikováno v:
Applied Thermal Engineering. 104:636-646
Most advanced, high power technologies require a large amount of heat to be dissipated from the limited surface area or space. Solutions to such problems are vital, among others, in the field of computer microchips, where promising designs of future
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb8bf3c516cc325bfa9c625d629ffa5f
https://doi.org/10.1016/j.applthermaleng.2016.05.096
https://doi.org/10.1016/j.applthermaleng.2016.05.096
Autor:
Przemysław Smakulski
Publikováno v:
Archives of Thermodynamics. 34:173-184
High heat flux removal are important issue in many perspective applications such as computer chips, laser diode arrays, or boilers working on supercritical parameters. Electronic microchips constructed nowadays are model example of high heat flux rem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fd644a37d8160e94df8bebcd3f10df4
https://doi.org/10.2478/aoter-2013-0023
https://doi.org/10.2478/aoter-2013-0023
Publikováno v:
MATEC Web of Conferences, Vol 240, p 05028 (2018)
The influence of thermal fluctuations and anisotropy on the solidification process of a pure component is analyzed. It helps to understand the unstable freezing process where complicated structures such as dendrites could be formed due to a supercool
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ffa60d011833cdd3c1da523906ea9161
https://doi.org/10.1051/matecconf/201824005028
https://doi.org/10.1051/matecconf/201824005028