Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Przemysław Smakulski"'
Publikováno v:
International Journal of Numerical Methods for Heat & Fluid Flow. 30:3005-3025
Purpose This paper aims to describe and investigate the mathematical models and numerical modeling of how a cell membrane is affected by a transient ice freezing front combined with the influence of thermal fluctuations and anisotropy. Design/methodo
Publikováno v:
International Journal of Heat and Mass Transfer. 184:122253
The qualitative mechanism of heat transfer during the cooling process by spraying M icro- S olid N itrogen (MSN2) together with the capability to vitrify a large-volume of samples is experimentally investigated in the article. The experiments were ca
Publikováno v:
Applied Thermal Engineering. 104:636-646
Most advanced, high power technologies require a large amount of heat to be dissipated from the limited surface area or space. Solutions to such problems are vital, among others, in the field of computer microchips, where promising designs of future
Autor:
Przemysław Smakulski
Publikováno v:
Archives of Thermodynamics. 34:173-184
High heat flux removal are important issue in many perspective applications such as computer chips, laser diode arrays, or boilers working on supercritical parameters. Electronic microchips constructed nowadays are model example of high heat flux rem
Publikováno v:
MATEC Web of Conferences, Vol 240, p 05028 (2018)
The influence of thermal fluctuations and anisotropy on the solidification process of a pure component is analyzed. It helps to understand the unstable freezing process where complicated structures such as dendrites could be formed due to a supercool
Autor:
Smakulski, Przemysław
Publikováno v:
Archives of Thermodynamics. 2013, Vol. 34 Issue 3, p173-184. 12p.
Publikováno v:
International Journal of Numerical Methods for Heat & Fluid Flow; 2020, Vol. 30 Issue 6, p3005-3025, 21p
Autor:
Grądziel, S., Łopata, S., Sobota, T., Zima, W., Smakulski, Przemysław, Ishimoto, Jun, Pietrowicz, Sławomir
Publikováno v:
MATEC Web of Conferences; 11/27/2018, Vol. 240, pN.PAG-N.PAG, 6p