Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Praveen Kumar Ramamoorthy"'
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
With the lead time to market for semiconductor products getting shorter, there is an ever increasing pressure on assembly and testing to reduce their yield time too. Sockets are the interface between the device under test (DUT) and the tester. Also,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fedc467e7b9d663181748d35c6d4551
https://doi.org/10.1109/eptc50525.2020.9315068
https://doi.org/10.1109/eptc50525.2020.9315068
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
As per the requirements of the market, current semiconductor trend is towards shrinking packages thereby reducing package dimensions. This in turn results in reduced lead pitch and width giving less space for contacting during final testing. Another
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9e9a23bd81bea9b24ef9cee304231b7
https://doi.org/10.1109/eptc.2016.7861554
https://doi.org/10.1109/eptc.2016.7861554
Publikováno v:
MATEC Web of Conferences, Vol 221, p 01010 (2018)
Test Contact Pin is used for testing the functionality and quality of the micro-devices at extreme temperatures before shipping to customers. The contact pin transfers current & signal to the device tested through dynamic contacting where the materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4d5bcf73417b4e0ed0495a67566c9ad5
https://doi.org/10.1051/matecconf/201822101010
https://doi.org/10.1051/matecconf/201822101010
Autor:
Praveen Kumar Ramamoorthy, Awang Bono
Publikováno v:
2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
Die temperature sensor (DTS) is an electrical circuit in a silicon chip/ Die to measure its temperature while testing the device at various temperatures for its functionality before being shipped to the customer. DTS reading beyond the specification
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::116d6fc7241b5cab072f85187a5633ef
https://doi.org/10.1109/semi-therm.2014.6892213
https://doi.org/10.1109/semi-therm.2014.6892213