Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Pratik Nimbalkar"'
Autor:
Pratik Nimbalkar, Pragna Bhaskar, Mohanalingam Kathaperumal, Madhavan Swaminathan, Rao R. Tummala
Publikováno v:
Polymers, Vol 15, Iss 19, p 3895 (2023)
The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for fa
Externí odkaz:
https://doaj.org/article/e7d565e713024ffdba420c679172159a
Autor:
Fuhan Liu, Pratik Nimbalkar, Nahid Aslani-Amoli, Mohanalingam Kathaperumal, Rao Tummala, Madhavan Swaminathan
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:291-299
Autor:
Pratik Nimbalkar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, Rao Tummala
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 22:59-64
Autor:
Pratik Nimbalkar, Pragna Bhaskar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, Rao Tummala
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Mohan Kathaperumal, Bai Nie, Pragna Bhaskar, Christopher Blancher, Pratik Nimbalkar, Fuhan Liu, Madhavan Swaminathan
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The ever-increasing demand for high-bandwidth interconnects has given rise to the need for high IO-density package redistribution layers (RDL). This necessitates scaling down RDL critical dimensions as well as microvias. There are numerous challenges
Autor:
Rao Tummala, Fuhan Liu, Mohanalingam Kathaperumal, Atsushi Kubo, Naoki Watanabe, Atom Watanabe, Cheng Ping Lin, Pratik Nimbalkar, David Weyers, Madhavan Swaminathan, Fukuya Naohito, Toshiyuki Makita
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Low-stress and low-warpage dielectrics are gaining importance as we move towards large-body Multi-chip Modules (MCMs). This paper demonstrates fabrication of redistribution layer (RDL) with 5 μm linewidth/spacing using a novel low-stress dielectric
Autor:
Fuhan Liu, Shreya Dwarakanath, Rao Tummala, Pratik Nimbalkar, Madhavan Swaminathan, Mohanalingam Kathaperumal, Bartlet H. DeProspo, Rui Zhang, David Weyers, Siddharth Ravichandran
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Currently, the IC industry has been steadily advancing towards 7 nm and 5 nm nodes with further reductions projected in the near future to progressively create large number of inputs and outputs (IOs) at finer pitch. Today the high-density interconne
Autor:
Bartlet H. DeProspo, Siddharth Ravichandran, Shreya Dwarakanath, Pratik Nimbalkar, Madhavan Swaminathan, Rao Tummala, Nithin Nedumthakady
Publikováno v:
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
The semiconductor and systems landscape are changing dramatically. As Moore's law begins to come to an end for many reasons that include minimal increase in transistor performance and in computer performance from node to node but at higher power, the
Publikováno v:
Materials Chemistry and Physics. 206:251-258
Polycarbonate (PC)/graphite nanoplatelet (GNP) nanocomposites were prepared using a facile solution-method followed by hot-compaction. The effects of GNP content on electrical properties and electromagnetic interference shielding effectiveness (EMI S