Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Pramusandi Sony"'
Publikováno v:
E3S Web of Conferences, Vol 382, p 24004 (2023)
An increasing large number of cornfield have been cultivated in highland of many Southeast Asian countries. In most cases, this corn plantation is done without proper soil & water conservation such as vetiver system (VS), thus causing land degradatio
Externí odkaz:
https://doaj.org/article/95f8dd6b9f6a459bab7ad65184e7df56
Autor:
Chaiprakaikeow, Susit, Jotisankasa, Apiniti, Praphatsorn, Washirawat, Shrestha, Avishek, Cheento, Sawek, Pramusandi, Sony, Chaisri, Pragith, Inazumi, Shinya
Publikováno v:
In Geotextiles and Geomembranes October 2024 52(5):860-873
Akademický článek
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Autor:
Suripto, Agung, Putera Agung Maha, Salimah, Aisyah, Hasan, Muhammad Fathur Rouf, Pramusandi, Sony, Winarsih, Neneng
Publikováno v:
AIP Conference Proceedings Online; October 2024, Vol. 3222 Issue: 1 p020006-20015, 10p
Autor:
Pradiptia, Andikanoza, Agung, Putera Agung Maha, Pramusandi, Sony, Hasan, Muhammad Fathur Rouf, Suripto, bin Zainorabidin, Adnan, Ahmad, Mustaffa Anjang
Publikováno v:
International Journal of Design & Nature & Ecodynamics; Dec2023, Vol. 18 Issue 6, p1299-1313, 15p
Publikováno v:
In Procedia Engineering 2015 125:376-382
Autor:
Suripto, Agung, Putera Agung Maha, Salimah, Aisyah, Hasan, Muhammad Fathur Rouf, Pramusandi, Sony, Winarsih, Neneng
Publikováno v:
AIP Conference Proceedings; 2024, Vol. 3222 Issue 1, pN.PAG-N.PAG, 1p
Autor:
Shrestha, Avishek, Jotisankasa, Apiniti, Chaiprakaikeow, Susit, Pramusandi, Sony, Soralump, Suttisak, Nishimura, Satoshi
Publikováno v:
Geosciences (2076-3263); Sep2019, Vol. 9 Issue 9, p362, 1p
Autor:
Suripto1 (AUTHOR) suripto.1965@sipil.pnj.ac.id, Agung, Putera Agung Maha1 (AUTHOR) putera.agungmagung@sipil.pnj.ac.id, Salimah, Aisyah1 (AUTHOR) aisyah.salimah@sipil.pnj.ac.id, Hasan, Muhammad Fathur Rouf1,2 (AUTHOR) rouf@sipil.pnj.ac.id, Pramusandi, Sony1 (AUTHOR) sony.pramusandi@sipil.pnj.ac.id, Winarsih, Neneng3 (AUTHOR) neneng.winarsih@ft.unsika.ac.id
Publikováno v:
AIP Conference Proceedings. 2024, Vol. 3222 Issue 1, pN.PAG-N.PAG. 1p.