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pro vyhledávání: '"Poshan Kumar Reddy"'
Autor:
Srikant Kumar Mohanty, Debashis Panda, K. Poshan Kumar Reddy, Po-Tsung Lee, Chien-Hung Wu, Kow-Ming Chang
Publikováno v:
Ceramics International. 49:16909-16917
Autor:
Kow-ming Chang, Jia-Chuan Lin, Poshan Kumar Reddy, Om Kumar Prasad, Chien-Hung Wu, Srikant Kumar Mohanty
Publikováno v:
IEEE Electron Device Letters. 42:1770-1773
Gradual conduction tuning with a large memory window is essential for realizing multilevel switching memristive devices. In this work, we demonstrated 3-bit per cell storage capability with excellent endurance and retention behavior of AlN/AlO memris
Autor:
Srikant Kumar Mohanty, Kuppam Poshan Kumar Reddy, Chien-Hung Wu, Po-Tsung Lee, Kow-Ming Chang, Prabhakar Busa, Yaswanth Kuthati
Publikováno v:
Electronics; Volume 11; Issue 21; Pages: 3432
In this work, we investigated the effect of the tungsten nitride (WNx) diffusion barrier layer on the resistive switching operation of the aluminum nitride (AlN) based conductive bridge random access memory. The WNx barrier layer limits the diffusion
Autor:
Poshan Kumar Reddy, K., Rameez, Mohammad, Wang, Tsai-Te, Wang, Kuangye, Yan-Ru Lin, Eric, Lin, Ming-Chang, Wei-Guang Diau, Eric, Hung, Chen-Hsiung, Chueh, Yun-Lun, Pande, Krishna P., Lee, Po-Tsung
Publikováno v:
In Materials Letters 15 April 2022 313
Autor:
Poshan Kumar Reddy Kuppam, K. M. M. D. K. Kimbulapitiya, Srikanth Vuppala, Kuangye Wang, G. Phaneendra Reddy, Krishna P. Pande, Po-Tsung Lee, Yun-Lun Chueh
Publikováno v:
Catalysts, Vol 12, Iss 58, p 58 (2022)
Catalysts; Volume 12; Issue 1; Pages: 58
Catalysts; Volume 12; Issue 1; Pages: 58
Replacing precious metals with low-cost metals is the best solution for large scale production. Copper is known for its excellent conductivity and thermal management applications. When it comes to hydrogen evolution reaction, it is highly unstable, e
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Autor:
K. Poshan Kumar Reddy, Mohammad Rameez, Tsai-Te Wang, Kuangye Wang, Eric Yan-Ru Lin, Ming-Chang Lin, Eric Wei-Guang Diau, Chen-Hsiung Hung, Yun-Lun Chueh, Krishna P. Pande, Po-Tsung Lee
Publikováno v:
Materials Letters. 313:131838