Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Po-Shao Shih"'
Autor:
Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, Chengheng Robert Kao
Publikováno v:
Materials, Vol 17, Iss 7, p 1638 (2024)
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interc
Externí odkaz:
https://doaj.org/article/c1b6cb9fdc1d480c81850d9d6000cfdc
Publikováno v:
Fluids, Vol 6, Iss 11, p 371 (2021)
Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of
Externí odkaz:
https://doaj.org/article/c3243841b204422b9cf565344afbb610
Autor:
Yung-Sheng Lin, Yun-Ching Hung, Chin-Li Kao, Chung-Hung Lai, Po-Shao Shih, Jeng-Hau Huang, David Tarng, C. Robert Kao
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5c4d93a8190cd73b31fd93e7b096a4d
https://doi.org/10.1109/ectc51906.2022.00038
https://doi.org/10.1109/ectc51906.2022.00038
Publikováno v:
Fluids
Volume 6
Issue 11
Fluids, MDPI, 2021, 6 (11), pp.371. ⟨10.3390/fluids6110371⟩
Fluids, Vol 6, Iss 371, p 371 (2021)
Volume 6
Issue 11
Fluids, MDPI, 2021, 6 (11), pp.371. ⟨10.3390/fluids6110371⟩
Fluids, Vol 6, Iss 371, p 371 (2021)
Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4aef0206647663d070d16ccb4e2c0fdf