Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Po-Hao Chiang"'
Autor:
Po-Hao Chiang, 江伯豪
104
Cu to Cu direct bonding is one of the key technologies for 3D chip stacking, especially for the connection of TSV. However, conventional Cu to Cu direct bonding exhibits some drawbacks, such as high bonding temperature, high vacuum, long bon
Cu to Cu direct bonding is one of the key technologies for 3D chip stacking, especially for the connection of TSV. However, conventional Cu to Cu direct bonding exhibits some drawbacks, such as high bonding temperature, high vacuum, long bon
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/57136971691663384416
Autor:
Sin-Yong Liang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, Po-Hao Chiang, Shang-Kun Huang, Jenn-Ming Song
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
An innovative pre-treatment to enhance Cu-to-Cu bonding through the exposure of electromagnetic radiations including flash light and near infrared rays is first proposed in this study. Short period of electromagnetic radiation exposure can significan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::216647f0b8392fb8fbd38415443a4540
https://doi.org/10.23919/ltb-3d.2017.7947439
https://doi.org/10.23919/ltb-3d.2017.7947439
Autor:
Jenn-Ming Song, Chih-Pin Hung, Sin-Yong Liang, Ying-Ta Chiu, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, David Tarng
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Cu-to-Cu direct bonding is one of the key technologies for 3D (three-dimensional) chip stacking. This research proposes a new concept to enhance Cu-Cu direct bonding through the control of residual stresses on bonding surface. Compressive residual st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b57ed688a040606272befe736a6db6a1
https://doi.org/10.23919/ltb-3d.2017.7947467
https://doi.org/10.23919/ltb-3d.2017.7947467
Autor:
Chih-Pin Hung, Po-Hao Chiang, Shang-Kun Huang, Sin-Yong Liang, Ying-Ta Chiu, Jing-Yuan Lin, David Tarng, Zong-Yu Xie, Jenn-Ming Song
Publikováno v:
Sensors and Materials. 30:2889
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c073929e533e15a4926945567f0f477c
https://doi.org/10.18494/sam.2018.1948
https://doi.org/10.18494/sam.2018.1948
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Taking the advantage of low sintering temperature and high processing flexibility, metallic nanoparticles (NPs) have been widely used to fabricate interconnections. To obtain excellent electrical conductivity, the surfactants protecting the nanoparti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d54cb910d36539e87dc7ff946a629034
https://doi.org/10.1109/icep.2016.7486802
https://doi.org/10.1109/icep.2016.7486802
Autor:
Jenn-Ming Song, Po-Hao Chiang
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
This study investigated the effect of pretreatments including annealing and air plasma irradiation, on the surface roughness and mechanical properties in the subsurface region of Cu blocks, as well as joint strength of directly-bonded samples. Remark
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec5b7e0a8f94299bcf07ac4e04e0e64a
https://doi.org/10.1109/icep.2016.7486875
https://doi.org/10.1109/icep.2016.7486875
Autor:
Jenn-Ming Song, Sin-Yong Liang, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, Jing-Yuan Lin
Publikováno v:
Sensors & Materials; 2018, Vol. 30 Issue 12, Part 2, p2889-2995, 7p
Publikováno v:
Japanese Journal of Applied Physics. 56:035503
Cu-to-Cu direct bonding is one of the key technologies for three-dimensional (3D) chip stacking. This research proposes a new concept to enhance Cu-to-Cu direct bonding through the control of surface physical properties. A linear relationship between
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0692696260fce93d9b5b0d8abe503f2
https://doi.org/10.7567/jjap.56.035503
https://doi.org/10.7567/jjap.56.035503
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP); 2016, p154-157, 4p
Publikováno v:
Japanese Journal of Applied Physics; Mar2017, Vol. 56 Issue 3, p1-1, 1p