Zobrazeno 1 - 1
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pro vyhledávání: '"Po-Ching Kau"'
Publikováno v:
Microelectronic Engineering. 75:145-148
A novel imprinting process has been developed for the use of resist pattern transfer on flexible transparent plastic substrates. The polymer resist was first spin-coated on the mold, which was treated with a release agent. After softbaking, the resis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a071351dfd7831fea9e7bfd95fb6cea3
https://doi.org/10.1016/j.mee.2004.03.084
https://doi.org/10.1016/j.mee.2004.03.084
