Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Po‐Cheng Shih"'
Autor:
Po-Cheng Shih, 施柏丞
99
The concept of corporate social responsibility has become an important academic issue. We want to investigate the relationship between corporate social responsibility and shareholder value by risk management perspective. We use event study to
The concept of corporate social responsibility has become an important academic issue. We want to investigate the relationship between corporate social responsibility and shareholder value by risk management perspective. We use event study to
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/24935070913351188397
Autor:
Po-Cheng Shih, 施伯錚
95
Among proposed lead-free solders, Sn-Ag-Cu ternary alloy has been regarded as the most potential candidate to replace the conventional Sn-Pb alloy. However, the eutectic melting point of Sn-Ag-Cu solder is notably higher (roughly 34oC) than t
Among proposed lead-free solders, Sn-Ag-Cu ternary alloy has been regarded as the most potential candidate to replace the conventional Sn-Pb alloy. However, the eutectic melting point of Sn-Ag-Cu solder is notably higher (roughly 34oC) than t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/98510766169877513901
Autor:
Po-Cheng Shih, 施柏成
94
Action Research of Web-Assisted Problem-Based Learning for Fourth Graders in the Domain of Natural Science and Life Technology Abstract This action research aimed at finding and tackling the challenges a teaching team encountered in a self-de
Action Research of Web-Assisted Problem-Based Learning for Fourth Graders in the Domain of Natural Science and Life Technology Abstract This action research aimed at finding and tackling the challenges a teaching team encountered in a self-de
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00168914099401047791
Autor:
Po-Cheng Shih, 施伯錚
91
The interfacial bonding behavior between Sn-Ag-Cu series lead-free solders and Cu/Ni-P/Au substrates were investigated in this work, which includes the shear strength measurement and interfacial reaction. The solder compositions are Sn-3.2Ag-
The interfacial bonding behavior between Sn-Ag-Cu series lead-free solders and Cu/Ni-P/Au substrates were investigated in this work, which includes the shear strength measurement and interfacial reaction. The solder compositions are Sn-3.2Ag-
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62788210599217926763
Publikováno v:
International Journal of Rheumatic Diseases. 26:183-186
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1f7650ca0728df94ab63042f3be5bb8
https://doi.org/10.1111/1756-185x.14485
https://doi.org/10.1111/1756-185x.14485
Publikováno v:
Seminars in Arthritis and Rheumatism. 60:152181
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c72c159f3e644da823755181ca0468b
https://doi.org/10.1016/j.semarthrit.2023.152181
https://doi.org/10.1016/j.semarthrit.2023.152181
106
Venerable Master Hsing Yun devoted his life to Humanistic Buddhism, championing an approach to the Dharma grounded in the reality of the 21st century and its challenges. In particular, he advocated spreading the Dharma through culture and ac
Venerable Master Hsing Yun devoted his life to Humanistic Buddhism, championing an approach to the Dharma grounded in the reality of the 21st century and its challenges. In particular, he advocated spreading the Dharma through culture and ac
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/v74g77
Publikováno v:
CISP-BMEI
The usage of automatic driving assistance systems (ADAS) has become more and more popular in recent years. In the design of ADAS, traffic sign detection (TSD) and traffic sign recognition (TSR) are two important functions and have been widely studied
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ead30f971e4d2ee90d076a181685bd8
https://doi.org/10.1109/cisp-bmei.2017.8301993
https://doi.org/10.1109/cisp-bmei.2017.8301993
Autor:
Po-Cheng Shih, Kwang-Lung Lin
Publikováno v:
Journal of Alloys and Compounds. 452:291-297
Solder balls were attached to the Cu/Ni–P/Au metallized BGA substrate. The two solder ball used in this study are Sn–3.2Ag–0.5Cu and Sn–3.5Ag–0.5Cu–0.07Ni–0.01Ge. The package was subjected to thermal aging at 150 °C for 100–1000 h in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8f07a46eb6990ed9613b11bd30b01f1
https://doi.org/10.1016/j.jallcom.2006.11.036
https://doi.org/10.1016/j.jallcom.2006.11.036
Autor:
Kwang-Lung Lin, Po-Cheng Shih
Publikováno v:
Journal of Alloys and Compounds. 439:137-142
Sn–8Zn–3Bi solder paste was applied as a medium to joint Sn–3.2Ag–0.5Cu solder balls and Au/Ni/Cu metallized ball grid array substrates at 210 °C. The spallation behavior of Ag–Au–Cu–Zn compound was studied as the Sn–Ag–Cu/Sn–Zn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc4b1c7a7a52d13b20972430ee257ebc
https://doi.org/10.1016/j.jallcom.2006.08.260
https://doi.org/10.1016/j.jallcom.2006.08.260