Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Pitica, Dan"'
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2022, Vol. 12 Issue 3, p422-428, 7p
Publikováno v:
2018 41st International Spring Seminar on Electronics Technology (ISSE).
The paper is focused on using quadrature demodulators in a measurement system. Quadrature demodulators are widely used in radiofrequency and communication fields. By using those demodulators, the measurement system is able to detect and quantify phas
Publikováno v:
Journal of Electrical and Electronics Engineering, Vol 5, Iss 1, Pp 199-202 (2012)
This paper is focused on the effect produced by systematic error of measurement devices in monitoring of a system, dam. The effect produced by systematic error in dam monitoring consist in a wrongdescription of dam evolution. Measurement errors lead
Publikováno v:
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Autor:
Pitica Dan, Jano Rajmond
Publikováno v:
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Through the course of this paper transient thermal conditions were investigated for through hole capacitor models built in SolidWorks. Firstly, the influences of the shape, casing material are determined, after which lifelike models for aluminum elec
Autor:
Pitica Dan, Jano Rajmond
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
The aim of the presented work is to study de behavior of through hole technology capacitors under extreme thermal stress conditions, both under static high temperatures and relatively fast temperature cycling during soldering processes. In consequenc
Publikováno v:
2016 IEEE 12th International Conference on Intelligent Computer Communication & Processing (ICCP); 2016, p349-352, 4p
Akademický článek
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Autor:
Vlad, Todor, Pitica, Dan
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE); 2015, p510-515, 6p
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE); 2015, p440-446, 7p