Thermal Transport and Mechanical Stress Mapping of a Compression Bonded GaN/Diamond Interface for Vertical Power Devices.

Autor: Delmas W; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Jarzembski A; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Bahr M; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., McDonald A; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Hodges W; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Lu P; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Deitz J; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Ziade E; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Piontkowski ZT; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States., Yates L; Sandia National Laboratories, Albuquerque, New Mexico 87123, United States.

Publikováno v: ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 Feb 28; Vol. 16 (8), pp. 11003-11012. Date of Electronic Publication: 2024 Feb 19.

Emergent interface vibrational structure of oxide superlattices.

Autor: Hoglund ER; Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA. erh3cq@virginia.edu., Bao DL; Department of Physics and Astronomy, Vanderbilt University, Nashville, TN, USA., O'Hara A; Department of Physics and Astronomy, Vanderbilt University, Nashville, TN, USA., Makarem S; Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA., Piontkowski ZT; Sandia National Laboratories, Albuquerque, NM, USA., Matson JR; Department of Mechanical Engineering and Electrical Engineering, Vanderbilt University, Nashville, TN, USA., Yadav AK; Department of Materials Science and Engineering, University of California Berkley, Berkley, CA, USA., Haislmaier RC; Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, USA., Engel-Herbert R; Paul-Drude-Institut für Festkörperelektronik, Berlin, Germany.; Institut für Physik, Humboldt-Universität zu Berlin, Berlin, Germany., Ihlefeld JF; Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA., Ravichandran J; Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, CA, USA., Ramesh R; Department of Materials Science and Engineering, University of California Berkley, Berkley, CA, USA., Caldwell JD; Department of Mechanical Engineering and Electrical Engineering, Vanderbilt University, Nashville, TN, USA., Beechem TE; Sandia National Laboratories, Albuquerque, NM, USA.; Center for Integrated Nanotechnologies, Sandia National Laboratories, Albuquerque, NM, USA.; School of Mechanical Engineering and the Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA., Tomko JA; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA., Hachtel JA; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, TN, USA. hachtelja@ornl.gov., Pantelides ST; Department of Physics and Astronomy, Vanderbilt University, Nashville, TN, USA. pantelides@vanderbilt.edu.; Department of Electrical and Computer Engineering, Vanderbilt University, Nashville, TN, USA. pantelides@vanderbilt.edu., Hopkins PE; Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA. phopkins@virginia.edu.; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA. phopkins@virginia.edu.; Department of Physics, University of Virginia, Charlottesville, VA, USA. phopkins@virginia.edu., Howe JM; Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA. jh9s@virginia.edu.

Publikováno v: Nature [Nature] 2022 Jan; Vol. 601 (7894), pp. 556-561. Date of Electronic Publication: 2022 Jan 26.