Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Pinyen Lin"'
Autor:
Cheng‐Ming Lin, Chuang‐Han Hsu, Wei‐Yu Huang, Vincent Astié, Po‐Hsien Cheng, Yue‐Min Lin, Wei‐Shan Hu, Szu‐Hua Chen, Han‐Yu Lin, Ming‐Yang Li, Blanka Magyari‐Kope, Chi‐Ming Yang, Jean‐Manuel Decams, Tzu‐Lih Lee, Dong Gui, Han Wang, Wei‐Yen Woon, Pinyen Lin, Jeff Wu, Jang‐Jung Lee, Szuya Sandy Liao, Min Cao
Publikováno v:
Advanced Materials Technologies. 7:2200022
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdd450ce8a39f381a5908fde327bcb8d
https://doi.org/10.1002/admt.202200022
https://doi.org/10.1002/admt.202200022
Publikováno v:
physica status solidi c. 12:1085-1089
SIRD (Scanning Infrared Depolarization Imager) and SIREX (Scanning Infrared Stress Explorer) are measurement systems to evaluate and visualize the stress distribution in semiconductor materials and devices. Some main fields of application are crystal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2dcc76c2a304c6bb90c77f00514fad1
https://doi.org/10.1002/pssc.201400356
https://doi.org/10.1002/pssc.201400356
Publikováno v:
Thin Solid Films. 520:4339-4343
Direct stamping of functional materials has been developed to reduce the number of processes and cost, and to increase throughput. However, there remain several challenging issues. One of the challenging issues is the residue-remaining problem after
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70bfd0f14b69c4f75b9aeb6083122a56
https://doi.org/10.1016/j.tsf.2012.02.070
https://doi.org/10.1016/j.tsf.2012.02.070
Publikováno v:
NIP & Digital Fabrication Conference. 25:449-451
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b90d28ef5a0b690d6d366f41d1de777d
https://doi.org/10.2352/issn.2169-4451.2009.25.1.art00014_2
https://doi.org/10.2352/issn.2169-4451.2009.25.1.art00014_2
Publikováno v:
MEMS Reference Shelf ISBN: 9780387473161
In this chapter we provide a concise understanding and appreciation of MEMS process integration – the technique by which processing steps are combined into an ordered sequence with the goal of creating a methodology that allows the production of fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c28e48a00081e3ce78f75ced11866de2
https://doi.org/10.1007/978-0-387-47318-5_14
https://doi.org/10.1007/978-0-387-47318-5_14
Publikováno v:
MEMS Reference Shelf ISBN: 9780387473161
Released structures, structures that move, free surfaces, and surfaces that contact one another in operation are all common in MEMS devices. Free surfaces on MEMS elements are crucial to device performance; hence, surface characteristics must be well
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63c6abf840a5f19172712fff402872f9
https://doi.org/10.1007/978-0-387-47318-5_13
https://doi.org/10.1007/978-0-387-47318-5_13
Autor:
Pinyen Lin, Reza Ghodssi
Publikováno v:
MEMS Reference Shelf ISBN: 9780387473161
MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Introduction - Reza Ghodssi and Pinyen Lin.- The MEMS Design Process - Tina Lamers and Beth Pruitt.- Additive Processes for Semiconductors and Dielectric Materials - Chris Zorman, Robert C. Roberts and Li Chen.- Additive Processes for Metals - David
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::039a6bbf1b1957e1ca4bc52405b8832e
https://doi.org/10.1007/978-0-387-47318-5
https://doi.org/10.1007/978-0-387-47318-5
Publikováno v:
2008 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5259f031c60a5d58bc788f2acc41bd86
https://doi.org/10.31438/trf.hh2008.81
https://doi.org/10.31438/trf.hh2008.81
Autor:
Reza Ghodssi, Pinyen Lin
MEMs Materials and Processes Handbook'is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on'Ma
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
Mechanical properties of SU-8 over the range of temperature, −50 to 250 °C, were measured. Traditional tension test is performed with the dog-bone specimens using microfabrication techniques. The bulk properties such as elastic modulus, Poisson’
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c080bc204d3bf1dd4762463f213b23d
https://doi.org/10.1115/imece2005-82647
https://doi.org/10.1115/imece2005-82647