Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Ping-Jung Liu"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 11, Pp 473-479 (2023)
PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation. XRD ana
Externí odkaz:
https://doaj.org/article/3ea4d3d903b24f3bbbb06894c9be0536
Autor:
Ping-Jung Liu, 劉秉融
99
In the progress of the electronics industry, the scale down of conventional metal oxide semiconductor thin film transistor (MOSFET) will emerge some reliability problems, such as short-channel effect, hot- carrier effect and drain-induce barr
In the progress of the electronics industry, the scale down of conventional metal oxide semiconductor thin film transistor (MOSFET) will emerge some reliability problems, such as short-channel effect, hot- carrier effect and drain-induce barr
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/4awym3
Autor:
Ping-Jung Liu, 劉炳榮
88
The progress of computer processing capability and the blooming of high speed networks allow us to take advantage of network of workstations to speed up information processing time. How to effectively use computing resources to increase the p
The progress of computer processing capability and the blooming of high speed networks allow us to take advantage of network of workstations to speed up information processing time. How to effectively use computing resources to increase the p
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/11727062065828901060
Autor:
Teodora Szasz, Emileigh Harrison, Ping-Jung Liu, Ping-Chang Lin, Hakizumwami Birali Runesha, Anjali Adukia
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2343ee1569897c45d6548db07c43872e
https://doi.org/10.2139/ssrn.4126594
https://doi.org/10.2139/ssrn.4126594