Zobrazeno 1 - 10
of 93
pro vyhledávání: '"Ping-Feng Yang"'
Autor:
Clifford Sandstrom, Benedict San Jose, Jen-Kuang Fang, Ping-Feng Yang, Sheng Feng-Huang, Ping-Ching Shen
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b560f868d8de2931870a644c7d450d3
https://doi.org/10.1109/eptc56328.2022.10013262
https://doi.org/10.1109/eptc56328.2022.10013262
Autor:
Yun Chih Tsai, Jia Rung He, Ping Feng Yang, Chun Han Hsu, Ya Yu Hsieh, Aswaghosh Loganathan, Hong Ping Lin
Publikováno v:
Journal of the Taiwan Institute of Chemical Engineers. 78:493-499
The present study focused on the preparation and characterization of a bio-based carbon-silica material derived from rice husk agricultural waste and its function in epoxy matrix for electronic packaging applications. X-ray diffraction (XRD) analysis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69de5260ec554e7d651ad9f6975a6335
https://doi.org/10.1016/j.jtice.2017.06.010
https://doi.org/10.1016/j.jtice.2017.06.010
Publikováno v:
Mathematics and Mechanics of Solids. 23:879-895
The interconversion relations for viscoelastic functions are derived with the consideration of the time-dependent bulk modulus, K( t), for both traditional and fractional Prony series representations of viscoelasticity. The application of these relat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4f8e799f24d4e4de3d3ff5687ed81fe
https://doi.org/10.1177/1081286517694935
https://doi.org/10.1177/1081286517694935
Autor:
Ying-Xu Lu, Chi-Hui Chien, Hsuan-Ting Liu, Ting-Hsuan Su, Yao-Lun Hu, Ping-Feng Yang, Chung-Ting Wang
Publikováno v:
Energy. 113:1174-1187
This study numerically investigated the effects of different bolt pre-loadings on the performance of the gas diffusion layer (GDL) in a bolted proton exchange membrane fuel cell (PEMFC). Firstly, a complete three-dimensional finite element model of a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d0a1d0bb9fab2177753228216841e38
https://doi.org/10.1016/j.energy.2016.07.075
https://doi.org/10.1016/j.energy.2016.07.075
Publikováno v:
Materials Chemistry and Physics. 182:72-76
Mechanical properties of thermoelectric (TE) materials are crucial for fabricating efficient and endurable TE devices. In this study, polycrystalline Bi 3 Se 2 Te thin films are grown on c -plane sapphire substrates at 250 °C and helium gas pressure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80c9eeaf360cc19dece8b5b8400c8e6b
https://doi.org/10.1016/j.matchemphys.2016.07.006
https://doi.org/10.1016/j.matchemphys.2016.07.006
Publikováno v:
Computational Materials Science. 117:412-421
Cu–Cu ultrasonic bonding is a highly promising technology for advanced interconnect technology for a 3D integrated circuit micro bump. The interface kinetic friction characteristic is also a key factor in determining the level of bonding for this t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e0436da064befdfbbac49bc31c7d7d1
https://doi.org/10.1016/j.commatsci.2016.01.043
https://doi.org/10.1016/j.commatsci.2016.01.043
Autor:
Chih-Lin Wu, Ping-Feng Yang, Kuo-Jung Lee, Chih-Feng Wang, Yan-Yu Chang, Pei-Kang Huang, Yi-Jung Tsai
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Carbon nanotubes (CNTs) have found enormous applicability in many areas of science and engineering because of their excellent electronic and thermal conductivity and mechanical properties. In this study, we fabricated CNT/polymer composites with CNTs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bad935b954fbc8c969a1942c6c5237b
https://doi.org/10.23919/icep.2018.8374652
https://doi.org/10.23919/icep.2018.8374652
Autor:
Chiu Wen Lee, Yen Sen Liao, Li Ming Chen, Wei Hsiang Wang, Min Hua Chung, Ping Feng Yang, Hong Ping Lin
Publikováno v:
Composites Part A: Applied Science and Manufacturing. 78:1-9
A simple synthetic method for placing a mesoporous silica coating on multi-wall carbon nanotubes (CNTs@MS) was developed to improve the surface compatibility with regard to a polar epoxy matrix. In addition, the mesoporous silica shell with silanol g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f3cb49dc894ea1b67906ba1f14e7055
https://doi.org/10.1016/j.compositesa.2015.07.019
https://doi.org/10.1016/j.compositesa.2015.07.019
Publikováno v:
Microelectronics Reliability. 55:822-831
The thermal mode analysis is used in this paper to optimize the thermal management with optimal locations and chip sizes for multi-chip package. The average thermal resistance is defined and analyzed. The spreading thermal resistance can be expanded
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c237911a2fcda03507999db22f06efe9
https://doi.org/10.1016/j.microrel.2015.02.016
https://doi.org/10.1016/j.microrel.2015.02.016
Autor:
Yu Chin Tseng, Ying-Yen Liao, Jenh-Yih Juang, Chih-Ming Lin, Sheng-Rui Jian, Hsueh Ju Chen, Ping Feng Yang, Cheng Hsun Tasi, Chih-Wei Luo, Dao Long Chen
Publikováno v:
Journal of Alloys and Compounds. 619:834-838
In this study, the microstructural, morphological and nanomechanical properties of Bi2Te3 thin films are investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM) and nanoindentation techniques. The Bi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32e354fda1bad8dc3ac0548a276fcc6a
https://doi.org/10.1016/j.jallcom.2014.09.028
https://doi.org/10.1016/j.jallcom.2014.09.028