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pro vyhledávání: '"Pi, Bensong"'
Autor:
Gu, Xiyu, Liu, Yan, Qu, Yuanhang, Wei, Min, Chen, Xiang, Wang, Yaxin, Liu, Wenjuan, Pi, Bensong, Woon Soon, Bo, Cai, Yao, Guo, Shishang, Sun, Chengliang
Publikováno v:
In Composite Structures 15 July 2024 340
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, cohesive zone modeling(CZM) was adopted to simulate the distribution of temperature & stress field and the interface damage on the Cu/EMC double adhesive material electronic packaging. The following phenomena were found: A sharp rise o