Zobrazeno 1 - 10
of 1 079
pro vyhledávání: '"Photonic integration"'
Autor:
Anja Agneter, Paul Muellner, Quang Nguyen, Dana Seyringer, Elisabet A. Rank, Marko Vlaskovic, Jochen Kraft, Martin Sagmeister, Stefan Nevlacsil, Moritz Eggeling, Alejandro Maese-Novo, Yevhenii Morozov, Nicole Schmitner, Robin A. Kimmel, Ernst Bodenstorfer, Pietro Cipriano, Horst Zimmermann, Rainer A. Leitgeb, Rainer Hainberger, Wolfgang Drexler
Publikováno v:
PhotoniX, Vol 5, Iss 1, Pp 1-21 (2024)
Abstract Photonic integrated circuits (PICs) represent a promising technology for the much-needed medical devices of today. Their primary advantage lies in their ability to integrate multiple functions onto a single chip, thereby reducing the complex
Externí odkaz:
https://doaj.org/article/77e52f28e78244a19c2d731f2c18997e
Autor:
Marco Gagino, Alonso Millan-Mejia, Luc Augustin, Kevin Williams, Erwin Bente, Victor Dolores-Calzadilla
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-10 (2024)
Abstract We present an integrated optical phased array (OPA) which embeds in-line optical amplifiers and phase modulators to provide beam-forming capability with gain and beam steering in the 1465–1590 nm wavelength range. We demonstrate up to 21.5
Externí odkaz:
https://doaj.org/article/3f491bfee412455b9a1d1132d2fbea43
Autor:
Aleksandr Zozulia, Jeroen Bolk, Rene van Veldhoven, Gleb Nazarikov, Vadim Pogoretskiy, Samir Rihani, Graham Berry, Kevin Williams, Yuqing Jiao
Publikováno v:
Micro and Nano Engineering, Vol 23, Iss , Pp 100258- (2024)
We present a novel fabrication approach to an integrated nanophotonic platform, based on a III-V membrane bonded to a Si substrate with benzocyclobutene (BCB). The process incorporates a hybrid lithography strategy combining deep-UV and electron-beam
Externí odkaz:
https://doaj.org/article/9b2a6ff8609e4356bd0977cc4a77f4a0
Autor:
Sen Yang, Zuoqin Ding, Xiao Li, Xiao Luo, Shuhua Zhai, Xiujun Zheng, Bo Wang, He Li, Zhuo Deng, Qianshi Wang, Sarp Kerman, Chang Chen
Publikováno v:
IEEE Photonics Journal, Vol 16, Iss 5, Pp 1-7 (2024)
In this paper, we present our process design kits (PDKs) component performances for different wavelengths in the visible to near-infrared (VIS-NIR) range on Shanghai Industrial μTechnology Research Institute's (SITRI's) 200 mm silicon nitride (SiN)
Externí odkaz:
https://doaj.org/article/26ad38db4fb14d7f84c9a8cc722e19b8
Autor:
Simon Nellen, Lauri Schwenson, Lars Liebermeister, Milan Deumer, Sebastian Lauck, Martin Schell, Robert B. Kohlhaas
Publikováno v:
IEEE Access, Vol 12, Pp 35246-35256 (2024)
Broadband terahertz spectroscopy is a valuable analytical tool in science and a promising technology for industrial non-destructive, non-contact testing, e.g. thickness measurements of thin dielectric layers. Optoelectronic conversion using photomixe
Externí odkaz:
https://doaj.org/article/22369c4a6a80409bbb4e3b3bb7bac7c0
Autor:
Aleksandar Nesic, Matthias Blaicher, Pablo Marin-Palomo, Christoph Füllner, Sebastian Randel, Wolfgang Freude, Christian Koos
Publikováno v:
Light: Advanced Manufacturing, Vol 4, Iss 3, Pp 251-262 (2023)
Multi-photon lithography has emerged as a powerful tool for photonic integration, allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical elements. These structures can be fabricated with
Externí odkaz:
https://doaj.org/article/dfde18d7ccb64d12b75dac514c965e90
Autor:
Yilin Xu, Pascal Maier, Mareike Trappen, Philipp-Immanuel Dietrich, Matthias Blaicher, Rokas Jutas, Achim Weber, Torben Kind, Colin Dankwart, Jens Stephan, Andreas Steffan, Amin Abbasi, Padraic Morrissey, Kamil Gradkowski, Brian Kelly, Peter O’Brien, Wolfgang Freude, Christian Koos
Publikováno v:
Light: Advanced Manufacturing, Vol 4, Iss 2, Pp 77-93 (2023)
Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field of optics and photonics, enabling many novel and disrupting a wide range of existing applications. However, scalable photonic packaging
Externí odkaz:
https://doaj.org/article/91c6d27f50564463a78165322edfcde4
Autor:
Adam Raptakis, Lefteris Gounaridis, Jörn P. Epping, Thi Lan Anh Tran, Thomas Aukes, Moritz Kleinert, Madeleine Weigel, Marco Wolfer, Alexander Draebenstedt, Christos Tsokos, Panos Groumas, Efstathios Andrianopoulos, Nikos Lyras, Dimitrios Nikolaidis, Elias Mylonas, Nikolaos Baxevanakis, Roberto Pessina, Erik Schreuder, Matthijn Dekkers, Volker Seyfried, Norbert Keil, René G. Heideman, Hercules Avramopoulos, Christos Kouloumentas
Publikováno v:
PhotoniX, Vol 4, Iss 1, Pp 1-27 (2023)
Abstract We demonstrate a compact heterodyne Laser Doppler Vibrometer (LDV) based on the realization of optical frequency shift in the silicon nitride photonic integration platform (TriPleX). We theoretically study, and experimentally evaluate two di
Externí odkaz:
https://doaj.org/article/0950df73036f4e899d19cbf881c4b68a
Autor:
Chunxue Wang, Daming Zhang, Jian Yue, Hang Lin, Xucheng Zhang, Tong Zhang, Changming Chen, Teng Fei
Publikováno v:
PhotoniX, Vol 4, Iss 1, Pp 1-15 (2023)
Abstract In this work, on-chip three-dimensional (3D) photonic integrated optical sources based on active fluorescent polymer waveguide microdisks are proposed for light display application. Fluorescent green and red oligomers with high-efficiency ph
Externí odkaz:
https://doaj.org/article/536d75611abf4b649dede873c88963fb
Publikováno v:
Guangtongxin yanjiu, Pp 1-16 (2023)
With the explosive growth of global network traffic and the consequent increase in bandwidth and energy consumption required for data transmission, traditional electronic interconnection architectures are no longer able to meet the requirement of the
Externí odkaz:
https://doaj.org/article/a6696ef617b5452daec025ebf1544ee3